How does the board board bubbler cause?

The surface bubbling of the circuit board is actually a problem of the bad adhesion of the board surface, and then the surface quality problem of the board surface is also extended, which contains two aspects:

1. Problem of panel cleanliness;

2. Problems of surface microroughness (or surface energy).

All board surface bubbling problems can be summarized as above.

Coating binding force between the poor or low, in the subsequent production process and assembly process is difficult to resist coating stress to the process of production and processing, mechanical stress and thermal stress, and so on, resulting in different degree of separation between the plating phenomenon.

It is possible to summarize some factors that may cause poor quality in the production process.

1. Problem of substrate technology processing:

Especially to some thinner base board (general 0.8mm below), because substrate rigidity is inferior, unfavorable use brush board machine to brush board.

So may be unable to effectively remove the substrate in order to prevent the surface oxidation of copper foil in the process of production and processing and special processing layer, while the layer is thinner, brush plate is easy to remove, but the chemical processing is difficult, so the important note in production and processing control, lest cause panel substrate copper foil and copper chemical bonding force between the surface bubbles caused by bad;When the problem is black in the thin inner layer, there will also be black brown color, uneven color, and local black brown.

2. The surface treatment of oil or other liquids contaminated with dust contaminated surfaces by the process of machining (drilling, laminating, milling, etc.).

3. Poor copper brush plate:

The pressure of the grinding plate before settling copper is too large, which causes the deformation of the orifice to brush out the round Angle of the copper foil and even the leakage of the base material, thus causing the foaming phenomenon of the orifice in the process of copper plating and spraying tin.Even brush plate caused no leakage base material, but excessive brush plate can increase the roughness of orifice copper, so copper foil at that point in the process of micro erosion coarsening susceptible to coarsening phenomenon of excessive, will exist certain quality hidden trouble;Therefore, it is necessary to pay attention to the control of the brush plate process, and the process parameters of the brush plate can be adjusted to the best by the grinding mark test and the water film test.

4. Washing problem:

Want because of heavy copper electroplating processing through a large number of chemical liquid medicine processing, all kinds of acid-base the non-polar organic solvent such as drugs, board face wash not clean, especially heavy copper adjustment in addition to the agents, not only can cause cross-contamination, also will cause the board face local processing bad or poor treatment effect, the defect of uneven, cause some of the binding force;Therefore, it is necessary to strengthen the control of water washing, mainly including the control of water flow, water quality, water washing time, and the time of dripping water.Especially in winter, the effect of washing will be greatly reduced.

5. Microerosion in pretreatment of copper and before electroplating and before electroplating:

Excessive microerosion can result in the leakage of the base material, causing bubbles around the orifice.The deficiency of microcorrosion can also cause the insufficiency of the binding force, causing the bubbling phenomenon;Therefore, it is necessary to strengthen the control of microerosion.General sink copper pretreatment of micro erosion depth in 1.5-2 micron, graphics processing before plating micro erosion in 0.3-1 micron, conditional best weighing method through chemical analysis and simple test control micro erosion thickness or for corrosion rate;In general, the surface of the plate is bright and bright, which is evenly pink and has no reflection.If the color is not uniform, or there is a reflection to show that there is a quality hidden trouble before the process;Pay attention to strengthen inspection;In addition, the copper content of the microgroove, the temperature of the tank liquid, the load capacity, and the content of the microemulsion are all the items to be paid attention to.

6. Poor copper rework:

Rework after some heavy copper or graphic board because tun bad plating, in the process of rework rework right way or micro etching time control in the process of rework or other reasons can cause foaming board face such as improper;The rework of the copper plate shall be reworked directly after washing, after washing and removing the oil directly from the line.It is better not to remove oil and corrosion;For the plate that has already plate electric thickening, it is necessary to reduce the plating on the micro-channel now, and pay attention to the time control. It can be used to calculate the time of the plating with one or two plates to ensure the effect of the fading.After the application of the washing machine, a group of soft brush will be brushed and then the normal production process will be used to sink the copper, but the time of the etching will be halved or necessary adjustment.

7. Oxidation of the plate during production:

If the copper plate is oxidized in the air, it may not only cause the copper in the hole, but also the rough surface of the plate, which may cause the foaming of the surface.The copper plate will be stored in acid for too long, and the surface will oxidize, which is difficult to remove.Therefore, in the process of production, the copper plate should be processed in a timely manner, and it should not be stored for too long. The copper plating should be finished in 12 hours at the latest.

8. The activity of the submerged copper liquid is too strong:

Sink copper liquid bath new cylinder or within the content of the three major components especially higher copper content is too high, will cause the slot liquid active too, chemical copper deposit is rough, hydrogen, cuprous oxide inclusions within chemical copper layer too much cause the decrease of the quality of the physical properties of the coating and binding force of the defects of bad;The following methods can be taken as follows: reduce the copper content,(add pure water to the tank liquid), including three components, improve the complexing agent and stabilizer content appropriately, and reduce the temperature of the tank;

9. Graphic transfer enhancement after washing is not enough, in the process of development after the place time is too long, or workshop dust too much, can cause bad (deltavave, fine treatment effect is a bit poor, may lead to potential quality problems;

10. Organic contamination in electroplating bath, especially oil pollution, is more likely to occur in the automatic line.

11 It is necessary to pay attention to the replacement of copper plating before plating, too much pollution in the tank solution, or too high copper content, which will not only cause the problem of surface cleanliness, but also lead to rough surface and other defects;

12. In addition, special attention should be paid to the charging slots of the production process boards, especially those with air stirring, such as copper and nickel, in the absence of heating in some factories during the winter.For the nickel cylinder in winter, it is better to add a warm wash tank before the nickel plating,(the water temperature is about 30-40 degrees), to ensure that the initial deposition of the nickel layer is dense and good.

In the process of practical production, the causes of board face blister, the author can only make a brief analysis, equipment technical level for different manufacturer may appear different causes of foaming phenomenon, specific things to specific analysis, cannot treat as the same, derivative;Regardless of primary and secondary importance and the cause analysis, do the brief analysis of basic according to the production process, in this series, just give you a direction to solve the problem and a more open field of vision, hope to process production and problem solving, can play the role of the topic!