HOREXS will attend to SemiconEuropa2024

HOREXS will attend to SemiconEuropa2024

AKEN Cheung 封装基板制造商 AKEN Cheung 封装基板制造商

AKEN Cheung 封装基板制造商

Director . Advanced packaging IC substrate manufacturer. Advantages: Cost reduction with realiability. FCBGA/ FCCSP/ CSP/ SiP/ Module/ BGA memory DDR3/DDR4/DDR5/ mmwave/ Embedded/ PCB substrate, uHDI PCB etc. mSAP

发布日期: 2024年7月1日
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HOREXS will attend the Semicon Eurpa 2024 Nov.11-15th at Munich city Germany, which the Booth is C6-220/9

HOREXS AKEN will attend to the SemiconEuropa 2024 in Munich Germany. Welcome to discuss PCB substrate cooperation with us.To explore with AKEN and see how HOREXS help to reduce your IC substrate cost with our high realiability guarantee.

HOREXS PCB Substrate manufacture capability:

1- More than 10 layers (Anylayers layup with blind/burry hole);

2- Layer to layer alignment accuracy：0.025mm;

3- CORE with resin filling;

4.- L/S (HVM)：20/20 um;

5- Impedance tolerance ±10%;

6- Outline tolerance ±0.1mm;

7- Finished thickness：0.1-1.22±0.1mm;

8- Own patent of PSR within 2um flatness;

HOREXS process:

1- mSAP, RCC, Substrative,

HOREXS production system:

1- MES , ERP

Applications:

Flash/nand memory(BGA), SiP package, CSP package, FCCSP package, FCBGA package.

Fingerprint/Sensors, MEMS, Microelectroics, RFmodule, mmwave, HDIPCB.


HOREXS-IC Substrate factory HOREXS-IC Substrate factory

HOREXS-IC Substrate factory

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