High Quality Placement With AIMEXR
AIMEXR always maintains correct placement by checking the conditions of electronic parts and panels using real time sensing technology and then reflecting check results to the machine.
High-accuracy placement as standard
Placements can be performed with a high accuracy of ±25 μm at all times; there are no constraints for the head type or the part to be placed. Additionally, the machine controls the push-in amount during placement and places with the appropriate pressure.
Not affected by changes in the surface height
Reliable placement is attained by detecting and adjusting for the panel warpage and individual part differences using advanced functions. Maintain productivity and support even large panels for which it is easy for the warpage to be large (up to 7 mm).
Checks for tombstoned, missing, and upside-down parts
The installed IPS system can cater to a wide range of checks, from part pickup stance to parts remaining on nozzles, as well as upside-down checks for minimold parts. It prevents placement defects attributed to packaging, nozzles, and parts.
Prevents defects associated with part properties
Placement defects caused by operation errors and defective parts are prevented by checking the electrical properties of chip parts with LCR checks and by checking the leads and bumps on IC parts with coplanarity checks. (Option)
For more information, or to view the catalog, visit the Fuji website.