Hierarchical Processing Core Classes with Cartridge-Based Protection for Environmental Resilience and SD Subclasses

Abstract

This research paper details the methods and protocols required to build premade processing cores divided into hierarchical classes, emphasizing the integration of cartridge-based protective cases for environmental resilience. The system utilizes Raspberry Pi and Libre AI boards, with a central PC ASUS Sage server. The hierarchical classes range from Class 1 to Class 17, each designed for specific applications and housed in protective cartridges for easy exchange and robust operation in various environments. Classes 7 through 17 include SD card subclasses to further refine their configurations.

1. Introduction

The need for durable and easily exchangeable processing units has led to the development of cartridge-based protective cases for hierarchical processing cores. This paper outlines the architecture, components, and configurations for creating these cores, focusing on their protection from environmental factors and ease of deployment.

2. System Architecture

The central hub for these processing cores is a PC ASUS Sage server with 8 PCIe slots and dual Xeon CPUs. This setup supports various configurations and hierarchical classes, ensuring scalability and versatility.

2.1 Server Configuration

  • Server Model: ASUS Sage server
  • CPU: Dual Xeon CPUs
  • PCIe Slots: 8
  • Ports Configuration: 6 ports for USB3 cards 1 port for GPU 1 port for deployment-specific use

3. Hierarchical Class Configurations

The hierarchical classes are divided into three main categories: processing cores (Class 1-3), facility operations cores (Class 4-6), and bot/station classes (Class 7-17), with protective cartridge cases and SD card subclasses introduced from Class 7 onwards.

3.1 Processing Cores (Class 1-3)

These cores vary based on USB3 card count, GPU type, RAM, and the number of Raspberry Pi and Libre AI boards.

  • USB3 Card Port Count: Class 1: 10 ports Class 2: 7 ports Class 3: 5 ports
  • GPU (NVIDIA Tesla): Class 1: 40GB Class 2: 25GB Class 3: 16GB
  • RAM (SDDR4): Class 1: 384GB Class 2: 192GB Class 3: 96GB
  • Raspberry Pi Count: Class 1: 40 Class 2: 28 Class 3: 20
  • Libre AI Count: Class 1: 20 Class 2: 14 Class 3: 10

3.2 Facility Operations Cores (Class 4-6)

These cores use PCSP Precision 7920 Tower Workstations for high-performance tasks.

  • USB3 Expansion Ports: Two 1USB3 to 8 USB3 external expansion ports Each port connects to 2 Libre AI and 6 Raspberry Pi boards
  • SD Card Volume: Class 4: 512GB Class 5: 256GB Class 6: 128GB

3.3 Bot/Station Classes (Class 7-17)

These classes feature protective cartridge cases for environmental resilience and easy exchange, and are further divided into SD card subclasses.

Class 7-9: Top Bot/Station Classes

  • Stack Configuration: Class 7: 20 Raspberry Pi and Libre AI boards Class 8: 10 boards Class 9: 8 boards
  • Subclasses (SD Card Volume): A: 512GB B: 256GB C: 128GB D: 64GB E: 32GB F: 16GB

Class 10-12: Standard Bot Cores

  • Single Stack Configuration: Class 10: 6 Raspberry Pi and 4 Libre AI Class 11: 3 Raspberry Pi and 2 Libre AI Class 12: 2 Raspberry Pi and 2 Libre AI
  • Subclasses (SD Card Volume): A: 512GB B: 256GB C: 128GB D: 64GB E: 32GB F: 16GB

Class 13-15: Complex Drone Cores

  • Division: Class 13: 6 boards Class 14: 4 boards Class 15: 3 boards
  • Subclasses (SD Card Volume): A: 512GB B: 256GB C: 128GB D: 64GB E: 32GB F: 16GB

Class 16: Base Drone Core

  • Stack Controller: 1 Raspberry Pi and 1 Libre AI board
  • Subclasses (SD Card Volume): A: 512GB B: 256GB C: 128GB D: 64GB E: 32GB F: 16GB

Class 17: Auxiliary/Peripheral Core

  • Configuration: 1 Raspberry Pi or 1 Libre AI board
  • Subclasses (SD Card Volume): A: 512GB B: 256GB C: 128GB D: 64GB E: 32GB F: 16GB

4. Protective Cartridge Cases

From Class 7 onwards, each processing core is housed in a protective cartridge case. These cases are designed to safeguard the cores from environmental factors and facilitate easy exchange in task-specific shells or skins.

4.1 Cartridge Design

  • Material: Durable, lightweight, and heat-resistant plastic or metal.
  • Form Factor: Slot-based, similar to old gaming systems, ensuring easy insertion and removal.
  • Sealing: Weatherproof sealing to protect against dust, moisture, and physical damage.
  • Cooling: Integrated passive or active cooling mechanisms to manage heat dissipation.

4.2 Corresponding Bays

  • Integration: Each bay is integrated into task-specific shells or skins representing different bots and drones.
  • Connection: Secure electrical connections ensuring reliable communication and power delivery.

5. Software Protocols

The implementation of these hierarchical classes requires specific software protocols to manage communication, processing, and task distribution among the boards.

5.1 Communication Protocols

  • MQTT: Lightweight messaging protocol for IoT devices.
  • ROS (Robot Operating System): Flexible framework for writing robot software.
  • gRPC: High-performance RPC framework for inter-microservice communication.

5.2 Operating Systems

  • Raspberry Pi: Raspberry Pi OS (formerly Raspbian)
  • Libre AI: Custom Linux distributions optimized for AI workloads.

5.3 Management Software

  • Kubernetes: Orchestration system for automating software deployment, scaling, and management.
  • Docker: Platform for developing, shipping, and running applications in containers.

6. Deployment Scenarios

The hierarchical processing cores can be deployed in various scenarios, from high-performance computing clusters to edge computing for IoT applications.

6.1 High-Performance Computing

Class 1-3 cores can be used for tasks requiring significant computational power, such as scientific simulations and large-scale data processing.

6.2 Facility Operations

Class 4-6 cores are ideal for facility operations, including VR rendering, AI processing, and high-resolution video editing.

6.3 Bot and Drone Applications

Class 7-17 cores are suited for robotics, autonomous drones, and smart devices, providing flexibility and scalability for various applications.

Scaling the Processing Capabilities of Hierarchical Processing Cores

Abstract

This section of the research paper details the scaling of processing capabilities for hierarchical processing cores, utilizing Raspberry Pi and Libre AI boards. The hierarchical classes, protected by cartridge-based cases, are scaled based on computational power, memory, and storage to meet diverse application requirements. This approach ensures that each class can handle increasingly complex tasks as needed.

1. Introduction

The scalability of processing cores is essential to meet varying computational demands. By scaling the processing capabilities, each hierarchical class can be tailored to specific application requirements, providing flexibility and efficiency in deployment.

2. System Architecture

The base system architecture remains the same with a PC ASUS Sage server acting as the central hub. However, the processing capabilities within each hierarchical class can be scaled up by adjusting key components such as CPU, RAM, storage, and the number of Raspberry Pi and Libre AI boards.

2.1 Server Configuration

  • Server Model: ASUS Sage server
  • CPU: Dual Xeon CPUs
  • PCIe Slots: 8
  • Ports Configuration: 6 ports for USB3 cards 1 port for GPU 1 port for deployment-specific use

3. Hierarchical Class Configurations

The hierarchical classes are scaled by increasing the number of key components. Each class is designed to scale up from a basic configuration to a more advanced setup.

3.1 Processing Cores (Class 1-3)

These cores can scale by increasing USB3 card count, upgrading GPUs, expanding RAM, and adding more Raspberry Pi and Libre AI boards.

  • Class 1: USB3 Card Ports: 10 GPU: NVIDIA Tesla 40GB RAM: 384GB Raspberry Pi Count: 40 Libre AI Count: 20 Max Scaling: USB3 Card Ports: 15 GPU: Dual NVIDIA Tesla 40GB RAM: 768GB Raspberry Pi Count: 60 Libre AI Count: 30
  • Class 2: USB3 Card Ports: 7 GPU: NVIDIA Tesla 25GB RAM: 192GB Raspberry Pi Count: 28 Libre AI Count: 14 Max Scaling: USB3 Card Ports: 10 GPU: Dual NVIDIA Tesla 25GB RAM: 384GB Raspberry Pi Count: 40 Libre AI Count: 20
  • Class 3: USB3 Card Ports: 5 GPU: NVIDIA Tesla 16GB RAM: 96GB Raspberry Pi Count: 20 Libre AI Count: 10 Max Scaling: USB3 Card Ports: 7 GPU: Dual NVIDIA Tesla 16GB RAM: 192GB Raspberry Pi Count: 28 Libre AI Count: 14

3.2 Facility Operations Cores (Class 4-6)

Facility operations cores can scale by expanding USB3 ports, increasing RAM, and adding more storage.

  • Class 4: USB3 Expansion Ports: 16 RAM: 192GB Storage: 1TB SSD + 4TB HDD Max Scaling: USB3 Expansion Ports: 24 RAM: 384GB Storage: 2TB SSD + 8TB HDD
  • Class 5: USB3 Expansion Ports: 16 RAM: 192GB Storage: 1TB SSD + 4TB HDD Max Scaling: USB3 Expansion Ports: 20 RAM: 384GB Storage: 2TB SSD + 8TB HDD
  • Class 6: USB3 Expansion Ports: 16 RAM: 192GB Storage: 1TB SSD + 4TB HDD Max Scaling: USB3 Expansion Ports: 18 RAM: 256GB Storage: 1.5TB SSD + 6TB HDD

3.3 Bot/Station Classes (Class 7-17)

Bot/station classes can scale by increasing the number of boards and enhancing storage capacities through SD card subclasses.

Class 7-9: Top Bot/Station Classes

  • Class 7: Stack Configuration: 20 Raspberry Pi and Libre AI boards Max Scaling: Stack Configuration: 30 Raspberry Pi and Libre AI boards
  • Class 8: Stack Configuration: 10 Raspberry Pi and Libre AI boards Max Scaling: Stack Configuration: 20 Raspberry Pi and Libre AI boards
  • Class 9: Stack Configuration: 8 Raspberry Pi and Libre AI boards Max Scaling: Stack Configuration: 15 Raspberry Pi and Libre AI boards

Class 10-12: Standard Bot Cores

  • Class 10: Single Stack Configuration: 6 Raspberry Pi and 4 Libre AI Max Scaling: Single Stack Configuration: 10 Raspberry Pi and 6 Libre AI
  • Class 11: Single Stack Configuration: 3 Raspberry Pi and 2 Libre AI Max Scaling: Single Stack Configuration: 5 Raspberry Pi and 3 Libre AI
  • Class 12: Single Stack Configuration: 2 Raspberry Pi and 2 Libre AI Max Scaling: Single Stack Configuration: 4 Raspberry Pi and 3 Libre AI

Class 13-15: Complex Drone Cores

  • Class 13: Division: 6 boards Max Scaling: Division: 10 boards
  • Class 14: Division: 4 boards Max Scaling: Division: 8 boards
  • Class 15: Division: 3 boards Max Scaling: Division: 6 boards

Class 16: Base Drone Core

  • Stack Controller: 1 Raspberry Pi and 1 Libre AI board
  • Max Scaling: Stack Controller: 2 Raspberry Pi and 2 Libre AI boards

Class 17: Auxiliary/Peripheral Core

  • Configuration: 1 Raspberry Pi or 1 Libre AI board
  • Max Scaling: Configuration: 2 Raspberry Pi or 2 Libre AI boards

4. Protective Cartridge Cases

From Class 7 onwards, each processing core is housed in a protective cartridge case. These cases are designed to safeguard the cores from environmental factors and facilitate easy exchange in task-specific shells or skins.

4.1 Cartridge Design

  • Material: Durable, lightweight, and heat-resistant plastic or metal.
  • Form Factor: Slot-based, similar to old gaming systems, ensuring easy insertion and removal.
  • Sealing: Weatherproof sealing to protect against dust, moisture, and physical damage.
  • Cooling: Integrated passive or active cooling mechanisms to manage heat dissipation.

4.2 Corresponding Bays

  • Integration: Each bay is integrated into task-specific shells or skins representing different bots and drones.
  • Connection: Secure electrical connections ensuring reliable communication and power delivery.

5. Software Protocols

The implementation of these hierarchical classes requires specific software protocols to manage communication, processing, and task distribution among the boards.

5.1 Communication Protocols

  • MQTT: Lightweight messaging protocol for IoT devices.
  • ROS (Robot Operating System): Flexible framework for writing robot software.
  • gRPC: High-performance RPC framework for inter-microservice communication.

5.2 Operating Systems

  • Raspberry Pi: Raspberry Pi OS (formerly Raspbian)
  • Libre AI: Custom Linux distributions optimized for AI workloads.

5.3 Management Software

  • Kubernetes: Orchestration system for automating software deployment, scaling, and management.
  • Docker: Platform for developing, shipping, and running applications in containers.

6. Deployment Scenarios

The hierarchical processing cores can be deployed in various scenarios, from high-performance computing clusters to edge computing for IoT applications.

6.1 High-Performance Computing

Class 1-3 cores can be used for tasks requiring significant computational power, such as scientific simulations and large-scale data processing.

6.2 Facility Operations

Class 4-6 cores are ideal for facility operations, including VR rendering, AI processing, and high-resolution video editing.

6.3 Bot and Drone Applications

Class 7-17 cores are suited for robotics, autonomous drones, and smart devices, providing flexibility and scalability for various applications.

8. Implementation Details

The implementation of the scaled hierarchical processing cores involves careful planning, hardware configuration, software setup, and testing. This section provides detailed steps for setting up each class, ensuring that the cores are optimized for their intended applications.

8.1 Hardware Configuration

8.1.1 Class 1-3 (High-Performance Processing Cores)

  1. Assemble the Server: Install dual Xeon CPUs on the ASUS Sage server motherboard. Insert the necessary PCIe cards (USB3, GPU) into the available slots. Install RAM modules according to the class requirements.
  2. Connect Raspberry Pi and Libre AI Boards: Use USB3 cards to connect Raspberry Pi boards. Connect Libre AI boards through the remaining USB3 ports.
  3. Install GPU: Insert the NVIDIA Tesla GPU into the designated PCIe slot.
  4. Ensure Adequate Power Supply: Connect a power supply unit capable of handling the power requirements of all components.
  5. Cooling Solutions: Install necessary cooling solutions (fans, heat sinks) to manage heat dissipation.

8.1.2 Class 4-6 (Facility Operations Cores)

  1. Assemble the Workstation: Install Intel Xeon Gold CPUs on the Precision 7920 Tower Workstation. Connect the necessary storage (SSD, HDD) to the motherboard. Install RAM modules according to the class requirements.
  2. Connect Raspberry Pi and Libre AI Boards: Use USB3 expansion ports to connect Raspberry Pi and Libre AI boards.
  3. Cooling and Power: Ensure adequate cooling and power supply for continuous operation.

8.1.3 Class 7-17 (Bot/Station and Drone Cores)

  1. Stack Configuration: Arrange Raspberry Pi and Libre AI boards in the specified stack configuration. Connect boards using appropriate cables and connectors.
  2. Protective Cartridge Cases: Insert the assembled stacks into protective cartridge cases. Ensure cases are sealed and cooled appropriately.
  3. Integration into Shells/Skins: Insert the cartridge cases into the corresponding bays in task-specific shells or skins.

8.2 Software Setup

8.2.1 Operating System Installation

  1. Raspberry Pi OS: Flash Raspberry Pi OS onto SD cards and insert them into the Raspberry Pi boards.
  2. Libre AI Linux Distribution: Flash the custom Linux distribution onto SD cards and insert them into the Libre AI boards.

8.2.2 Network Configuration

  1. IP Assignment: Assign static IP addresses to each Raspberry Pi and Libre AI board for easy identification and management.
  2. Network Security: Implement firewall rules and secure communication protocols (SSH, VPN) to protect the network.

8.2.3 Software and Frameworks

  1. Install Docker and Kubernetes: Install Docker on each board to enable containerization. Set up Kubernetes for orchestration and management of containers.
  2. Deploy ROS and MQTT: Install and configure ROS for robotic applications. Set up MQTT for lightweight messaging between IoT devices.

8.3 Testing and Validation

8.3.1 Functional Testing

  1. Component Testing: Verify each component (CPU, RAM, GPU, Raspberry Pi, Libre AI boards) functions correctly.
  2. Integration Testing: Ensure all components work together seamlessly within each class configuration.

8.3.2 Performance Testing

  1. Benchmarking: Conduct performance benchmarks to measure computational power, memory usage, and network throughput.
  2. Stress Testing: Perform stress tests to evaluate system stability under heavy load conditions.

8.3.3 Environmental Testing

  1. Protection Validation: Test the effectiveness of protective cartridge cases against dust, moisture, and physical impact.
  2. Cooling Efficiency: Monitor temperature and cooling efficiency during operation.

9. Use Cases and Applications

The scaled hierarchical processing cores can be applied across a wide range of fields, from scientific research and industrial automation to smart cities and autonomous systems.

9.1 Scientific Research

  • Simulations and Modeling: High-performance cores (Class 1-3) can run complex simulations and models for scientific research.

9.2 Industrial Automation

  • Facility Management: Facility operations cores (Class 4-6) can manage industrial processes, including VR rendering and AI processing.

9.3 Smart Cities

  • IoT Infrastructure: Bot and station cores (Class 7-17) can support IoT infrastructure, managing data from sensors and actuators.

9.4 Autonomous Systems

  • Drones and Robots: Drone cores (Class 13-16) can be used in autonomous drones for various applications such as surveillance, delivery, and environmental monitoring.

11. Detailed Class Configurations and Scaling

This section provides detailed configurations for each hierarchical class, including the scaled capabilities and specifications for each component.

11.1 Class 1-3 (High-Performance Processing Cores)

Class 1:

  • Base Configuration: USB3 Card Ports: 10 GPU: NVIDIA Tesla 40GB RAM: 384GB Raspberry Pi Count: 40 Libre AI Count: 20
  • Max Scaling: USB3 Card Ports: 15 GPU: Dual NVIDIA Tesla 40GB RAM: 768GB Raspberry Pi Count: 60 Libre AI Count: 30

Class 2:

  • Base Configuration: USB3 Card Ports: 7 GPU: NVIDIA Tesla 25GB RAM: 192GB Raspberry Pi Count: 28 Libre AI Count: 14
  • Max Scaling: USB3 Card Ports: 10 GPU: Dual NVIDIA Tesla 25GB RAM: 384GB Raspberry Pi Count: 40 Libre AI Count: 20

Class 3:

  • Base Configuration: USB3 Card Ports: 5 GPU: NVIDIA Tesla 16GB RAM: 96GB Raspberry Pi Count: 20 Libre AI Count: 10
  • Max Scaling: USB3 Card Ports: 7 GPU: Dual NVIDIA Tesla 16GB RAM: 192GB Raspberry Pi Count: 28 Libre AI Count: 14

11.2 Class 4-6 (Facility Operations Cores)

Class 4:

  • Base Configuration: USB3 Expansion Ports: 16 RAM: 192GB Storage: 1TB SSD + 4TB HDD
  • Max Scaling: USB3 Expansion Ports: 24 RAM: 384GB Storage: 2TB SSD + 8TB HDD

Class 5:

  • Base Configuration: USB3 Expansion Ports: 16 RAM: 192GB Storage: 1TB SSD + 4TB HDD
  • Max Scaling: USB3 Expansion Ports: 20 RAM: 384GB Storage: 2TB SSD + 8TB HDD

Class 6:

  • Base Configuration: USB3 Expansion Ports: 16 RAM: 192GB Storage: 1TB SSD + 4TB HDD
  • Max Scaling: USB3 Expansion Ports: 18 RAM: 256GB Storage: 1.5TB SSD + 6TB HDD

11.3 Class 7-17 (Bot/Station and Drone Cores)

Class 7-9: Top Bot/Station Classes

Class 7:

  • Base Configuration: Stack Configuration: 20 Raspberry Pi and Libre AI boards SD Card Subclasses: A (512GB), B (256GB), C (128GB), D (64GB), E (32GB), F (16GB)
  • Max Scaling: Stack Configuration: 30 Raspberry Pi and Libre AI boards

Class 8:

  • Base Configuration: Stack Configuration: 10 Raspberry Pi and Libre AI boards SD Card Subclasses: A (512GB), B (256GB), C (128GB), D (64GB), E (32GB), F (16GB)
  • Max Scaling: Stack Configuration: 20 Raspberry Pi and Libre AI boards

Class 9:

  • Base Configuration: Stack Configuration: 8 Raspberry Pi and Libre AI boards SD Card Subclasses: A (512GB), B (256GB), C (128GB), D (64GB), E (32GB), F (16GB)
  • Max Scaling: Stack Configuration: 15 Raspberry Pi and Libre AI boards

Class 10-12: Standard Bot Cores

Class 10:

  • Base Configuration: Single Stack Configuration: 6 Raspberry Pi and 4 Libre AI SD Card Subclasses: A (512GB), B (256GB), C (128GB), D (64GB), E (32GB), F (16GB)
  • Max Scaling: Single Stack Configuration: 10 Raspberry Pi and 6 Libre AI

Class 11:

  • Base Configuration: Single Stack Configuration: 3 Raspberry Pi and 2 Libre AI SD Card Subclasses: A (512GB), B (256GB), C (128GB), D (64GB), E (32GB), F (16GB)
  • Max Scaling: Single Stack Configuration: 5 Raspberry Pi and 3 Libre AI

Class 12:

  • Base Configuration: Single Stack Configuration: 2 Raspberry Pi and 2 Libre AI SD Card Subclasses: A (512GB), B (256GB), C (128GB), D (64GB), E (32GB), F (16GB)
  • Max Scaling: Single Stack Configuration: 4 Raspberry Pi and 3 Libre AI

Class 13-15: Complex Drone Cores

Class 13:

  • Base Configuration: Division: 6 boards SD Card Subclasses: A (512GB), B (256GB), C (128GB), D (64GB), E (32GB), F (16GB)
  • Max Scaling: Division: 10 boards

Class 14:

  • Base Configuration: Division: 4 boards SD Card Subclasses: A (512GB), B (256GB), C (128GB), D (64GB), E (32GB), F (16GB)
  • Max Scaling: Division: 8 boards

Class 15:

  • Base Configuration: Division: 3 boards SD Card Subclasses: A (512GB), B (256GB), C (128GB), D (64GB), E (32GB), F (16GB)
  • Max Scaling: Division: 6 boards

Class 16: Base Drone Core

  • Base Configuration: Stack Controller: 1 Raspberry Pi and 1 Libre AI board SD Card Subclasses: A (512GB), B (256GB), C (128GB), D (64GB), E (32GB), F (16GB)
  • Max Scaling: Stack Controller: 2 Raspberry Pi and 2 Libre AI boards

Class 17: Auxiliary/Peripheral Core

  • Base Configuration: Configuration: 1 Raspberry Pi or 1 Libre AI board SD Card Subclasses: A (512GB), B (256GB), C (128GB), D (64GB), E (32GB), F (16GB)
  • Max Scaling: Configuration: 2 Raspberry Pi or 2 Libre AI boards

12. Future Work and Enhancements

Future work will focus on further optimizing the architecture, improving energy efficiency, and expanding the range of applications. Key areas for future research and development include:

12.1 Energy Efficiency

  • Renewable Energy Integration: Exploring the integration of renewable energy sources (solar, wind) to power the processing cores.
  • Advanced Cooling Solutions: Developing more efficient cooling solutions to reduce energy consumption.

12.2 Enhanced Security

  • Hardware Security Modules (HSMs): Incorporating HSMs to enhance data security and encryption.
  • Intrusion Detection Systems (IDS): Implementing IDS to monitor and protect the processing cores from cyber threats.

12.3 Machine Learning and AI Integration

  • Edge AI: Enhancing the AI capabilities of the cores to perform complex tasks at the edge.
  • Federated Learning: Implementing federated learning to enable distributed AI model training without centralized data storage.

12.4 Modular Expansion

  • Pluggable Modules: Developing pluggable modules for easy expansion and customization of the cores.
  • Universal Cartridges: Creating universal cartridges compatible with various classes for increased flexibility.

13. Conclusion

The hierarchical processing core architecture utilizing Raspberry Pi and Libre AI boards provides a scalable, flexible, and robust solution for diverse applications. The introduction of protective cartridge cases ensures environmental resilience, while SD card subclasses and scaling options offer configurability and adaptability to specific use cases. This approach ensures that the processing cores can meet increasing computational demands and remain operational in challenging environments. Future work will focus on enhancing energy efficiency, security, AI integration, and modular expansion to further improve the capabilities of the processing cores.

Appendices

Appendix A: Detailed Component Specifications

A.1 USB3 Cards

  • Model: StarTech.com 4 Port USB 3.0 PCIe Card
  • Ports: 4 USB 3.0 ports
  • Data Transfer Rate: Up to 5Gbps
  • Compatibility: Compatible with any PCI Express slot
  • Additional Features: UASP support for faster data transfer

A.2 NVIDIA Tesla GPUs

  • Tesla 40GB: Memory: 40GB GDDR5 CUDA Cores: 3072 Memory Bandwidth: 288 GB/s Power Consumption: 235W
  • Tesla 25GB: Memory: 25GB GDDR5 CUDA Cores: 2048 Memory Bandwidth: 200 GB/s Power Consumption: 185W
  • Tesla 16GB: Memory: 16GB GDDR5 CUDA Cores: 1536 Memory Bandwidth: 144 GB/s Power Consumption: 150W

A.3 RAM (SDDR4)

  • Manufacturer: Corsair Vengeance LPX
  • Speed: 3200MHz
  • Capacity: 384GB: 12 x 32GB modules 192GB: 6 x 32GB modules 96GB: 3 x 32GB modules
  • Latency: CL16

A.4 Raspberry Pi

  • Model: Raspberry Pi 4 Model B
  • CPU: Quad-core Cortex-A72 (ARM v8) 64-bit SoC @ 1.5GHz
  • RAM: Options of 2GB, 4GB, or 8GB LPDDR4-3200 SDRAM
  • Connectivity: 2.4 GHz and 5.0 GHz IEEE 802.11ac wireless Bluetooth 5.0, BLE Gigabit Ethernet
  • Ports: 2 USB 3.0 ports 2 USB 2.0 ports 2 micro HDMI ports (supports up to 4Kp60)

A.5 Libre AI Board

  • Model: Libre AI SOM (System on Module)
  • CPU: Quad-core Cortex-A53 + Dual-core Cortex-M4
  • RAM: 2GB/4GB LPDDR4
  • Storage: 16GB eMMC (expandable via SD card)
  • Connectivity: Wi-Fi 802.11 b/g/n/ac Bluetooth 4.2
  • AI Capabilities: Integrated NPU for AI acceleration

Appendix B: Software Installation Guides

B.1 Raspberry Pi OS Installation

  1. Download the Raspberry Pi OS: Visit the official Raspberry Pi website and download the latest version of Raspberry Pi OS.
  2. Flash the OS to SD Card: Use software like Balena Etcher to flash the downloaded OS image to an SD card.
  3. Boot the Raspberry Pi: Insert the SD card into the Raspberry Pi and power it on.
  4. Initial Setup: Follow the on-screen instructions to set up the OS, including configuring the network and updating the system.

B.2 Libre AI Linux Distribution Installation

  1. Download the Libre AI OS: Visit the official Libre AI website and download the custom Linux distribution optimized for AI workloads.
  2. Flash the OS to SD Card: Use Balena Etcher to flash the OS image to an SD card.
  3. Boot the Libre AI Board: Insert the SD card into the Libre AI board and power it on.
  4. Initial Setup: Follow the setup instructions to configure network settings and update the system.

B.3 Docker and Kubernetes Installation

  1. Install Docker: On each board, execute the following commands to install Docker:

sh

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sudo apt-get update

sudo apt-get install -y docker.io

sudo systemctl start docker

sudo systemctl enable docker

  1. Install Kubernetes: Install kubectl, kubeadm, and kubelet:

sh

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sudo apt-get update

sudo apt-get install -y apt-transport-https curl

curl -s https://packages.cloud.google.com/apt/doc/apt-key.gpg | sudo apt-key add -

sudo apt-add-repository "deb https://apt.kubernetes.io/ kubernetes-xenial main"

sudo apt-get update

sudo apt-get install -y kubelet kubeadm kubectl

sudo apt-mark hold kubelet kubeadm kubectl

  1. Initialize Kubernetes Cluster: On the master node, run:

sh

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sudo kubeadm init --pod-network-cidr=10.244.0.0/16

  1. Configure kubectl: Set up the kubeconfig file:

sh

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mkdir -p $HOME/.kube

sudo cp -i /etc/kubernetes/admin.conf $HOME/.kube/config

sudo chown $(id -u):$(id -g) $HOME/.kube/config

  1. Install a Pod Network Add-on: Install Flannel as the network add-on:

sh

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kubectl apply -f https://raw.githubusercontent.com/coreos/flannel/master/Documentation/kube-flannel.yml

  1. Join Worker Nodes to the Cluster: Run the kubeadm join command provided by the master node on each worker node to add them to the cluster.

Appendix C: Test Plans and Benchmarks

C.1 Functional Testing

  1. Component Testing: Verify individual components (USB3 cards, GPUs, RAM modules, Raspberry Pi, and Libre AI boards) are functioning correctly.
  2. Integration Testing: Test the integration of all components within each class configuration to ensure they work together seamlessly.

C.2 Performance Testing

  1. Benchmarking Tools: Use tools such as sysbench, Phoronix Test Suite, and iperf to measure CPU, memory, and network performance.
  2. Benchmarking Scenarios: CPU Performance: Run CPU-intensive tasks and record performance metrics. Memory Performance: Measure memory bandwidth and latency. Network Throughput: Test network performance between nodes.

C.3 Stress Testing

  1. Load Testing: Use tools like stress-ng to apply continuous load on the system and monitor stability.
  2. Thermal Testing: Monitor system temperature during stress tests to evaluate cooling efficiency.

C.4 Environmental Testing

  1. Protection Validation: Test the protective cartridge cases against dust, moisture, and physical impact to ensure they provide adequate protection.
  2. Cooling Efficiency: Use temperature sensors to monitor the effectiveness of the cooling solutions during operation.

Appendix D: Example Use Cases

D.1 High-Performance Computing

  • Application: Climate modeling and simulation
  • Class: 1
  • Configuration: Max scaling with dual NVIDIA Tesla GPUs and 768GB RAM

D.2 Facility Operations

  • Application: AI-based video rendering
  • Class: 5
  • Configuration: Max scaling with 20 USB3 expansion ports and 2TB SSD

D.3 Smart Cities

  • Application: Real-time traffic management
  • Class: 9
  • Configuration: Base configuration with SD Card Subclass A (512GB)

D.4 Autonomous Drones

  • Application: Environmental monitoring
  • Class: 13
  • Configuration: Max scaling with 10 boards and SD Card Subclass B (256GB)

14. Acknowledgments

We would like to thank the Raspberry Pi Foundation, Libre AI, and the developers of Kubernetes and Docker for providing the tools and resources necessary for the development of this hierarchical processing core architecture.

15. Contact Information

For further information or collaboration opportunities, please contact:

  • Name: Ian Sato McArdle
  • Email: [email protected]
  • Institution: N/A
  • Address: 451 Florence Ave


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References

Hardware References

  1. Raspberry Pi Foundation. (n.d.). Raspberry Pi Documentation. Retrieved from https://www.raspberrypi.org/documentation/
  2. Libre Computer Project. (n.d.). Libre AI Board Documentation. Retrieved from https://libre.computer/products/
  3. NVIDIA. (n.d.). NVIDIA Tesla GPU Accelerators. Retrieved from https://www.nvidia.com/en-us/data-center/tesla/
  4. Intel. (n.d.). Intel Xeon Scalable Processors. Retrieved from https://www.intel.com/content/www/us/en/products/processors/xeon/scalable.html
  5. Corsair. (n.d.). Corsair Vengeance LPX DDR4 RAM. Retrieved from https://www.corsair.com/us/en/Categories/Products/Memory/VENGEANCE-LPX/p/CMK16GX4M2B3200C16
  6. StarTech.com. (n.d.). 4 Port USB 3.0 PCIe Card. Retrieved from https://www.startech.com/en-us/cards-adapters/pexusb3s4v
  7. Dell. (n.d.). Precision 7920 Tower Workstation. Retrieved from https://www.dell.com/en-us/work/shop/cty/pdp/spd/precision-7920-workstation

Software References

  1. Raspberry Pi OS. (n.d.). Raspberry Pi OS Downloads. Retrieved from https://www.raspberrypi.org/software/
  2. Libre AI Linux Distribution. (n.d.). Libre AI OS. Retrieved from https://libre.computer/firmware/
  3. Docker. (n.d.). Docker Documentation. Retrieved from https://docs.docker.com/
  4. Kubernetes. (n.d.). Kubernetes Documentation. Retrieved from https://kubernetes.io/docs/
  5. MQTT. (n.d.). MQTT Protocol. Retrieved from https://mqtt.org/
  6. ROS. (n.d.). Robot Operating System Documentation. Retrieved from https://www.ros.org/
  7. Balena Etcher. (n.d.). Flash OS images to SD cards & USB drives safely and easily. Retrieved from https://www.balena.io/etcher/

Benchmarking and Testing References

  1. Sysbench. (n.d.). Sysbench Documentation. Retrieved from https://github.com/akopytov/sysbench
  2. Phoronix Test Suite. (n.d.). Comprehensive Testing and Benchmarking Platform. Retrieved from https://www.phoronix-test-suite.com/
  3. Iperf. (n.d.). Iperf - The ultimate speed test tool for TCP, UDP, and SCTP. Retrieved from https://iperf.fr/
  4. Stress-ng. (n.d.). Stress Test and Hardware Optimization. Retrieved from https://kernel.ubuntu.com/~cking/stress-ng/

Networking and Communication References

  1. OpenVPN. (n.d.). Secure Networking. Retrieved from https://openvpn.net/
  2. Secure Shell (SSH). (n.d.). SSH Secure Shell. Retrieved from https://www.ssh.com/ssh/

Future Enhancements References

  1. Renewable Energy Integration. (n.d.). National Renewable Energy Laboratory (NREL). Retrieved from https://www.nrel.gov/
  2. Federated Learning. (n.d.). Federated Learning for AI. Retrieved from https://ai.googleblog.com/2017/04/federated-learning-collaborative.html
  3. Intrusion Detection Systems. (n.d.). Suricata Documentation. Retrieved from https://suricata-ids.org/

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