Hermetic Packaging Market to Reach USD 4.7 BN By 2028 - Credence Research
The key players in the global hermetic packaging market in terms of value and volume include SCHOTT, Amkor Technology Inc., AMETEK Inc., Texas Instruments Incorporated, Kyocera Corporation, Teledyne Technologies, Materion Corporation, Egide, Legacy Technologies Inc., SGA Technologies, Hermetics Solutions Group, Rosenberger, and Willow Technologies.
The latest market report published by Credence Research, Inc.?“Global Hermetic Packaging Market: Growth, Future Prospects, and Competitive Analysis, 2016 – 2028″. The?Global Hermetic Packaging Market generated revenue of around USD 3.7 billion in 2021 and is anticipated to grow a CAGR of over 4.1% during the forecast period from 2022 to 2028 to reach around USD 4.7 billion in 2028. While cumulative growth opportunity presented by the global hermetic packaging is around USD 1.008 billion from 2022 to 2028.
Consumer electronics’ expanding popularity and their widespread use in packaging activities are two factors propelling the market’s expansion. The growing middle class, shifting lifestyle preferences, and a rising inclination to use smart electronic gadgets are some of the main drivers supporting the expansion of the worldwide consumer electronics market. Hermetic packaging has a broad range of applications in packaging operations of developing industries, which is a significant factor propelling the market for hermetic packaging. Foods, medications, and other chemicals need packaging that keeps a seal against gas passage. Barrier packing and vacuum packaging of packaged foods are two hermetic packaging techniques that significantly aid in the prevention of the content. In addition, hermetic Packaging is engaged in infrastructure development, construction, and food and beverage. Airtight technologies are being used in structures created using sustainable architectural principles to save energy.
The global Hermetic Packaging market is bifurcated into Configuration, Type, Application, Industry, and Geography. Based on configuration, the market is categorized into multilayer ceramic packages, pressed ceramic packages, and metal can packages. Based on type, the global market is segmented into passivation glass, reed glass, transponder glass, glass-metal sealing (GTMS), and ceramic-metal sealing (CERTM). Based on the application, the market is bifurcated into transistors, sensors, lasers, airbag ignitors, photo diodes, oscillating crystals, MEMS switches, and others. By industry, the market is categorized into military & defense, aeronautics & space, automotive, energy & nuclear safety, medical, telecommunication, consumer electronics, and others. On the basis of geography, the market is segmented as North America, Europe, Asia Pacific, Latin America, and the Middle East and Africa.
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