Heatsinks vs. Heat Spreaders: Understanding the Difference
When it comes to managing heat in electronic systems, both heatsinks and heat spreaders play crucial roles in ensuring the performance and longevity of your electronic components by preventing overheating and permanent damage. Understanding their differences, applications, and trade-offs can help engineers make better design decisions. At PHYTEC, we understand the importance of tailored thermal solutions in embedded systems and offer expertise in integrating these technologies to suit specific application needs. This blog will break down the basics of heatsinks and heat spreaders, their roles in thermal management, and how PHYTEC incorporates these solutions in our system-on-modules (SOMs) and hardware designs.
What Is a Heatsink?
A heatsink is a passive cooling device that dissipates heat away from a component by increasing the surface area exposed to the surrounding air. Heatsinks are typically made of thermally conductive materials like aluminum or copper and are used in conjunction with fans or other cooling systems for enhanced heat dissipation.
Key Features of Heatsinks:
Pros of Heatsinks:
Cons of Heatsinks:
What Is a Heat Spreader?
A heat spreader is a device that distributes heat evenly across a larger surface area. It does not necessarily dissipate heat into the surrounding environment but rather prepares it for further cooling via heatsinks, fans, liquid cooling systems, metal housing contact, etc. Heat spreaders are typically flat on top and made of materials like copper or graphite. The heat spreader differs from the heatsink due to the lack of fins on top.
Key Features of Heat Spreaders:
Pros of Heat Spreaders:
Cons of Heat Spreaders:
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Choosing Between Heatsinks and Heat Spreaders
The choice between a heatsink and a heat spreader depends on your application:
PHYTEC’s Thermal Solutions
At PHYTEC, we offer both heat spreaders and heatsinks, each designed with custom form fitting undersides to perfectly pair with our SOMs. Customers can choose to purchase a Thermal Management Evaluation Kit to determine the optimal setup for their application or directly purchase a heat spreader or heatsink from PHYTEC. Additionally, PHYTEC offers free design files for both systems, allowing customers to modify the designs to suit their specific housing and enabling cost-effective mass production with their preferred manufacturer.
What Makes PHYTEC’s Design Special?
Heatsink Design
Our heatsink design features the classic square fin structure on top for efficient heat dissipation, matched with a custom-molded underside to ensure seamless contact with the SOM. This ensures that all critical components, including known warm components (PMIC, SoC, DDR, PHY), are making perfect contact with the heatsink.
Key features include:
The heatsink system included in PHYTEC’s Thermal Management Evaluation accessory kit can be implemented in a final application when paired with a fan.
Heat Spreader Design
Our heat spreader shares the same custom fit for optimal thermal contact but features a flat top surface instead of fins.
Key features include:
Unlike the heatsink, the heat spreader cannot accommodate a fan and requires pairing with an external thermal solution for final applications.
Stay Cool
Visit PHYTEC’s Thermal Management Evaluation Accessories pages for purchasing details or check out the product pages for a deeper dive into our design files and thermal notes. Have questions? Reach out to our team for personalized support and guidance!