HDI PCB & High Density Interconnect PCB

Compare to standard Rigid PCB, HDI PCB request much higher wiring density with finer trace and spacing, smaller vias and higher connection pad density. Blind and buried vias'design is one of their marked feature.HDI PCB are widely used for Cell Phone, tablet computer, digital camera, GPS, LCD module and other different area. The advantages of HDI PCB include:

• Reduce the cost
• Better reliability
• Increase the wiring density
• Increase design efficiency
• Can improve the thermal properties
• In favor of the use of advanced packaging technology
• Has better electrical performance and signal correctness
• Can improve the radio frequency interference, electromagnetic interference and electrostatic discharge

Currently the advanced HDI technology we used include: "Copper Filled" for special stack microvia, "Laser Direct Imaging"(LDI) is specifically designed for fine line technology, to eliminate dimensional stability problem of artwork caused by environmental and material issues. "Direct Laser Drill"(DLD) is drilling of copper layer by direct CO2 laser irradiation, compare to additional laser drilling with conformal mask, the copper direct laser drilling is capable of providing higher accuracy, better hole quality and better efficiency for HDI projects

General Specification for HDI PCB

Layer Count: 4-20Layers

Type of stack up: 1+N+1, 2+N+2

Material Available: FR4, High Tg FR4, Halogen Free FR4

Board thickness: 0.4-3.2mm

Finished copper thickness: 1/3oz – 3oz

Min trace width/spacing: 3/3mil

Min through hole: 0.2mm

Min blind via: 0.1mm

Surface treatment: Immersion Gold, ENIG + OSP