HDI Hybrid PCB 8-Layer 1.5mm Based on RO4003C and S10002M

Basic PCB Specifications

This advanced 8-layer printed circuit board (PCB) is engineered for high-performance applications, showcasing a blend of cutting-edge materials and precise specifications. Here’s an overview of its critical attributes:

• Board Type: 8 layers
• Material Type: RO4003C (Rogers) and FR-4 (Tg170°C)
• Solder Mask: Green on both sides
• Silkscreen Print: White on the top side
• Surface Finish: Electroless Nickel Immersion Gold (ENIG)
• Total Board Thickness: 1.5 mm ± 10%
• Board Size: 87.5 mm x 40.6 mm (1 piece)
• Minimum Hole Size: 0.2 mm
• Solder Mask Thickness: 10 μm
• Minimum Dielectric Thickness: 100 μm
• Minimum Trace Line Width: 115 μm
• Minimum Spacing: 135 μm
• Blind Vias: Yes, between layers 1-2 and 7-8
• Buried Vias: Yes, between layers 2-7
• Back Drilled Vias: Yes, from layers 1-6
• Impedance Controlled: 50 Ohm Differential Pairs: Top layer, 4 mil trace/gap, reference layer 2 100 Ohm Differential Pairs: Top layer, 5 mil trace/gap, reference layer 2 50 Ohm Single End: Top layer, 6 mil trace, reference layer 2
• Via Specifications: All 0.3 mm vias are filled and capped per IPC 4761 Type VII.
• Edge Plating: Required.

PCB Stack-up

The stack-up of this PCB is meticulously crafted to optimize both electrical performance and mechanical reliability. A detailed breakdown of the layer structure reveals how each component contributes to the board's overall functionality.

The stack-up begins with a copper layer, followed by the RO4003C core, and includes multiple alternating layers of copper and FR-4 materials. This layered approach ensures that the PCB can handle high-frequency signals while maintaining structural integrity. Each layer is specified according to IPC standards, further ensuring the board's reliability and performance.

Artwork and Quality Standards

For production, the type of artwork supplied is Gerber RS-274-X, which is widely recognized in the PCB manufacturing industry. Adhering to the IPC-Class-2 quality standard ensures that this board meets the necessary reliability and performance criteria.

Moreover, this PCB is available for worldwide distribution, making it accessible for various industries and applications.

Introducing RO4003C

Rogers RO4003C is a state-of-the-art material that combines woven glass reinforcement with hydrocarbon and ceramic components. This unique blend provides the exceptional performance of PTFE materials while maintaining the manufacturability associated with traditional epoxy/glass (FR-4) processes.

What sets RO4003C apart is its low loss characteristics, specifically designed for RF microwave circuits and controlled impedance transmission lines. Its low dielectric loss makes it ideal for high-frequency applications where conventional materials may falter. Additionally, RO4003C is available in diverse configurations, ensuring compliance with stringent electrical performance standards.

Features of RO4003C

The properties of RO4003C further enhance its suitability for high-frequency applications.

• Dielectric Constant (Dk): 3.38 ± 0.05 at 10 GHz
• Dissipation Factor: 0.0027 at 10 GHz
• Thermal Conductivity: 0.71 W/m/°K
• Thermal Coefficient of Dielectric Constant: +40 ppm/°C, with a range of -50°C to 150°C
• CTE Matched to Copper: X-axis of 11 ppm/°C, Y-axis of 14 ppm/°C
• Low Z-Axis Coefficient of Thermal Expansion: 46 ppm/°C
• Glass Transition Temperature (Tg): >280°C
• Moisture Absorption: Low at 0.06%

These characteristics make RO4003C an excellent choice for applications requiring stable performance under high-frequency conditions.

Features of S1000-2M

Complementing the RO4003C, the S1000-2M material enhances PCB performance with notable features that contribute to its effectiveness in various applications.

The S1000-2M material boasts a low Z-axis coefficient of thermal expansion (CTE) of 2.4 ppm/°C, ensuring superior reliability in through-hole applications. Its high Tg of 185°C accommodates lead-free soldering processes, making it ideal for modern manufacturing requirements. Furthermore, the material exhibits low water absorption of 0.08%, providing humidity resistance that enhances the PCB's durability.

With a thermal resistance of T260 for 60 minutes and T288 for 30 minutes, along with a UL 94-V0 flammability rating, S1000-2M solidifies its position as a reliable choice for high-performance PCBs.

Typical Applications

This meticulously designed 8-layer PCB is well-suited for a diverse array of high-frequency applications. Typical uses include cellular base station antennas and power amplifiers, RF identification tags, automotive radar and sensors, LNBs for direct broadcast satellites, and various computing, communication, and automotive electronics.

The versatility of this PCB makes it an invaluable component in modern electronic systems, capable of meeting the demands of a rapidly evolving technology landscape.

Conclusion

In summary, the combination of RO4003C and FR-4 materials in this 8-layer PCB creates a robust solution for high-frequency applications. With its precise specifications and durable construction, this PCB is primed to meet the modern demands of electronic devices, ensuring reliability and performance across various industries. The thoughtful engineering and material selection involved in its design position it as a leading choice for engineers and designers aiming for excellence in their PCB solutions.