HBM package substrate

A comprehensive introduction to HBM packaging technology

High Bandwidth Memory (HBM) is a memory technology used for high-performance computing. It uses 3D packaging technology to vertically stack multiple DRAM (Dynamic Random Access Memory) chips together with a logic chip. Connected through silicon via (TSV, Through-Silicon Via) technology. The emergence and development of HBM aims to solve the bottleneck problems of traditional memory technology in terms of bandwidth, power consumption and space utilization.

Main features of HBM packaging technology

1. High bandwidth

A notable feature of HBM technology is its high bandwidth. Through 3D stacking and TSV technology, HBM can provide extremely high data transfer rates in a small package area. The bandwidth of the first generation HBM can reach 128GB/s, while the bandwidth of HBM2 and HBM2E can reach 256GB/s and 460GB/s respectively. The latest HBM3 bandwidth has exceeded 800GB/s. This high bandwidth has significant advantages for applications that require parallel processing of large amounts of data, such as graphics processors, artificial intelligence training, and scientific computing.

2. Low power consumption

HBM has lower power consumption than traditional GDDR (Graphics Double Data Rate) memory. HBM reduces the power consumption during signal transmission by shortening the physical distance between the memory chip and the processor. At the same time, the high bandwidth characteristics of HBM enable it to achieve high performance at a lower operating frequency, thereby further reducing power consumption. This can significantly reduce energy consumption and cooling requirements for data centers and high-performance computing systems.

3. High space utilization

HBM uses 3D stacking technology to vertically stack multiple memory chips together and achieves high-speed interconnection between chips through TSV technology. This packaging method significantly reduces the space occupied by the memory module, allowing the memory to be more compactly integrated into the system. This has important implications for space-constrained devices such as high-performance graphics cards and mobile devices.

4. High reliability and flexibility

HBM packaging technology is designed with high reliability and flexibility in mind. HBM memory modules can automatically detect and correct errors in data transmission through on-chip error correction code (ECC) functions, improving data integrity and system stability. In addition, HBM's modular design allows it to be flexibly used in different system architectures to meet various application needs.

Application fields of HBM packaging technology

1. Graphics Processing Unit (GPU)

HBM was originally jointly developed by AMD and SK Hynix and was first used in high-performance graphics processors. The high bandwidth and low power consumption of HBM enable the GPU to significantly improve performance and efficiency when performing graphics rendering and complex calculations. Currently, many high-end GPUs use HBM or HBM2 technology.

2. Artificial Intelligence (AI) and Machine Learning (ML)

AI and ML applications require processing large amounts of data and complex computing tasks. HBM's high bandwidth and low latency characteristics enable it to significantly accelerate data processing and improve computing efficiency during AI training and inference. Therefore, HBM is widely used in AI accelerators and dedicated AI processors.

3. Data centers and high-performance computing (HPC)

Data centers and HPC systems need to handle massive amounts of data and highly concurrent tasks. HBM's high bandwidth and low power consumption make it an ideal choice for data centers and HPC systems. By integrating HBM, servers and supercomputers can process data more efficiently while reducing energy consumption and operating costs.

4. Network and communications equipment

5G communications and high-performance network equipment require high-speed data transmission and processing capabilities. HBM's high bandwidth and low latency characteristics enable it to meet the high performance and low power consumption requirements of 5G base stations and network equipment, supporting faster data rates and lower latency.

Market prospects of HBM packaging technology

With the growing demand for high-performance computing and data processing, the market prospects of HBM technology are very broad. According to market research data, the HBM market size will continue to maintain rapid growth in the next few years, with the main driving force coming from the demand for AI, HPC, data centers and high-end graphics processors. Major memory manufacturers such as Samsung, SK Hynix and Micron are actively promoting the R&D and production of HBM technology and constantly launching higher-performance HBM products.

Professional experience and technical advantages

HOREXS is a company with more than 15 years of experience in the field of memory chip packaging substrate manufacturing. The company focuses on the production of DDR, LDDDR and DDR5 packaging substrates, and has achieved mass production for customers. HOREXS's products are known for their stable quality, and the company has more production capacity to provide customers with sufficient support. It currently does not have the ability to produce HBM packaging substrates.

Cost control and customer support

One of the features of HOREXS is to minimize costs for customers with the same quality. Through efficient production processes and meticulous quality control, HOREXS not only ensures the high quality of products, but also makes significant contributions to cost control. This is extremely attractive to customers looking for reliable and cost-effective solutions in the highly competitive storage market.

Technological innovation and market expansion

HOREXS has always been committed to technological innovation and constantly improving the manufacturing process of packaging substrates to meet changing market demands. The company uses advanced technology in its R&D and production processes to ensure high performance and reliability of its products. Against the background of strong growth in memory chip market demand, HOREXS actively responds to market changes and meets customer needs by continuously improving its technical level and expanding production capacity.

HOREXS’s focus on HBM packaging technology

Although HOREXS currently does not have the ability to produce HBM packaging substrates and mainly manufactures BT packaging substrates, and focuses on the production of DDR, LDDDR and DDR5 packaging substrates, the company maintains a high degree of attention to the development of HBM packaging technology. HOREXS will continue to improve its technical capabilities and keep up with the technical elements of HBM packaging to ensure that it can provide customers with support and solutions at the right time. HOREXS is committed to meeting the needs of the market and customers, and will further expand its technical fields in the future to cater to the trends of the high-performance storage market.

in conclusion

As the cutting-edge development of memory technology, HBM packaging technology is being widely used in various high-performance computing and data-intensive application fields due to its characteristics of high bandwidth, low power consumption and high space utilization. As the global market's demand for high-performance storage continues to grow, the market prospects for HBM packaging technology are very broad.

HOREXS provides strong support for the rapid development of the global storage market through its excellent manufacturing capabilities and cost control strategies. Whether in the production of DDR5 packaging substrates or the research and development of advanced BF Buildup materials, HOREXS has demonstrated its strong strength and forward-looking vision as an industry leader. Although HOREXS has not yet been involved in the manufacturing of HBM packaging substrates, the company will continue to follow the development of HBM technology, continuously improve its technical capabilities, and cater to market trends and customer needs. As the storage market continues to evolve and expand, HOREXS will continue to play a key role in driving innovation and progress in the industry.