HBM package substrate

HBM (High Bandwidth Memory) is an advanced memory technology for high-performance computing and graphics processing. The HBM package substrate (or HBM substrate) is a key component of this memory technology, used to achieve high-density and high-bandwidth memory stacking. Here are some details about the HBM package substrate:

Features of HBM package substrate

High bandwidth

HBM uses vertical stacking technology and through-silicon vias (TSV) to achieve close integration of multiple DRAM chips, thereby greatly improving data transmission bandwidth.

Low power consumption

HBM has lower power consumption than traditional GDDR memory due to shortened data transmission paths and more efficient memory architecture.

High density

By vertically stacking multiple DRAM chips, HBM can provide higher storage density in a smaller footprint, suitable for space-constrained application scenarios.

High performance

HBM has high performance characteristics and can support large-scale parallel computing and data-intensive applications such as artificial intelligence training, scientific computing, and high-end graphics processing.

Structure of HBM package substrate

DRAM stacking

Multiple DRAM chips are stacked vertically, and electrical connections between chips are achieved through TSV.

Logic Layer

The stacked DRAM chips are located on a logic layer that contains the memory controller and other control logic.

Interposer

The substrate is used to connect the HBM stacked module and the main processor (such as CPU or GPU), usually using silicon interposer technology to provide high-density and high-precision interconnection.

Manufacturing process of HBM package substrate

TSV production

TSV is formed in the DRAM chip by etching and filling conductive materials such as copper, which is used to vertically connect chips at different layers.

Chip stacking

Multiple DRAM chips are stacked vertically on the logic layer through precise alignment and welding technology.

Interposer technology

The HBM module is connected to the main processor using a silicon interposer, which contains dense interconnection lines to ensure high-bandwidth and low-latency data transmission.

Packaging

The entire HBM module is packaged on a packaging substrate to protect the internal structure and provide connections to external circuits.

Application of HBM package substrate

High-performance computing (HPC)

In supercomputers and high-performance servers, HBM provides the necessary high-bandwidth and low-latency memory support.

Graphics Processing

High-end graphics cards and graphics processing units (GPUs) use HBM to meet the needs of complex graphics calculations and rendering.

Artificial Intelligence and Deep Learning

In AI and deep learning training, HBM provides the high-bandwidth memory support required for the rapid processing of large amounts of data.

Data Center

Large data centers use HBM to improve data processing speed and energy efficiency.

Major Companies

The following are some of the major HBM packaging substrate manufacturing and application companies:

Samsung Electronics

As a leader in HBM technology, Samsung produces and supplies a variety of HBM products.

SK Hynix

SK Hynix is another major HBM manufacturer, providing HBM memory for high-performance computing and graphics applications.

Micron Technology

Micron is also involved in the research and development and production of HBM, providing high-bandwidth memory solutions.

AMD

AMD uses HBM technology in its high-end GPUs and APUs to improve the graphics processing and computing performance of its products.

NVIDIA

NVIDIA uses HBM in its high-end graphics cards and computing accelerators to meet the needs of high-performance computing and AI applications.

Future Trends

Increasing Bandwidth and Capacity

Future versions of HBM will continue to increase the bandwidth and capacity of a single stack to meet the growing demand for data processing.

Reducing Costs

Through improved manufacturing processes and economies of scale, the production cost of HBM is expected to decrease, making it popular in more applications.

Expanding Application Areas

In addition to high-performance computing and graphics processing, HBM will gradually be applied to more fields, such as automotive electronics, the Internet of Things, and edge computing.

In short, HBM packaging substrates, as a high-performance memory solution, are developing rapidly and will continue to drive the advancement of computing and graphics processing technologies in the future.

Where is the technical difficulty of HBM packaging substrates?

The technical difficulty of HBM (High Bandwidth Memory) packaging substrates is mainly concentrated in the following aspects:

1. TSV (Through-Silicon Via) technology

Manufacturing complexity: The TSV process involves etching through holes on silicon wafers and filling them with conductive materials (usually copper), which requires a high-precision and high-consistency manufacturing process.

Stress management: TSV introduces mechanical stress, which may affect the reliability and performance of the chip. Managing these stresses requires precise design and process control.

Thermal management: As TSV increases the density of the chip, the heat dissipation problem becomes more prominent, requiring an effective thermal management solution.

2. Interposer technology

Complex manufacturing process: The interposer (usually a silicon interposer) requires high-density, high-precision interconnect lines to achieve electrical connections between chips and between chips and the outside. The manufacturing process of this high-density wiring is very complex.

Size and alignment accuracy: The interposer requires precise size control and alignment to ensure the correct connection between the stacked chips and the logic bottom layer.

3. Alignment and bonding of stacked chips

Alignment accuracy: The vertical stacking of multi-layer chips requires extremely high alignment accuracy. Even micron-level alignment errors can cause electrical connection problems.

Binding technology: During the stacking process, reliable chip bonding technology is required to ensure stable mechanical and electrical connections of each layer of chips.

4. Thermal management

Heat dissipation design: The high-density chip stacking in the HBM package generates a lot of heat, and an efficient heat dissipation solution must be designed to avoid overheating that affects chip performance and reliability.

Material selection: The selection of thermal interface materials and thermal management design are critical in HBM packaging and directly affect the thermal performance of the system.

5. Power and signal integrity

Power distribution: The power distribution and power integrity issues caused by high-density stacking require special attention to ensure that each layer of chips can work stably.

Signal integrity: High-bandwidth data transmission needs to ensure signal integrity to avoid data transmission errors caused by interference, crosstalk and attenuation.

6. Process yield and cost control

Process yield: Due to the complexity of HBM packaging, a high defect rate may occur during the manufacturing process, and the process needs to be continuously optimized to improve the yield.

Cost control: The complex manufacturing process and high-precision equipment requirements make HBM packaging costly, and the cost needs to be reduced through technological progress and economies of scale.

7. Packaging and testing

Packaging process: HBM packaging requires advanced packaging technology to protect the internal structure and provide reliable electrical connections.

Test complexity: The characteristics of high density and high bandwidth make the testing of HBM packaging more complicated, requiring sophisticated testing equipment and methods to ensure product quality.

8. Design and verification

Complex design process: HBM packaging involves multiple levels of design, including TSV design, interposer design, chip stacking design, etc. It is necessary to comprehensively consider electrical, thermal, mechanical and other factors.

Verification and simulation: During the design process, a lot of verification and simulation are required to ensure that the expected performance can be achieved during actual manufacturing and use.

In general, HBM packaging substrate technology involves many aspects of high-precision manufacturing processes, high-density electrical interconnection, efficient thermal management and complex design verification, all of which place high demands on technical level and process control. Only through continuous technological innovation and process optimization can these challenges be overcome and high-performance HBM packaging be achieved.

How is the development of HBM packaging substrate in China?

In China, HBM (High Bandwidth Memory) packaging substrate technology is developing rapidly. With China's increasing investment in semiconductors and high-performance computing, HBM technology has gradually become an important direction for promoting scientific and technological progress. The following is China's development in the field of HBM packaging substrates:

Policy and financial support

Policy promotion

The Chinese government attaches great importance to the development of the semiconductor industry and has introduced a number of policies to encourage independent research and development and technological innovation. The National Integrated Circuit Industry Investment Fund (referred to as the "Big Fund") has provided a lot of financial support to semiconductor companies and promoted the research and industrialization of advanced technologies such as HBM.

Scientific research funds

Governments and scientific research institutions at all levels have provided a lot of scientific research funds to support the research and development of HBM technology, including the National Natural Science Foundation and the Ministry of Science and Technology's key research and development plan.

Major companies

Huawei

Huawei has made huge investments in the semiconductor field. Its subsidiary HiSilicon Semiconductor is actively developing and applying HBM technology in the fields of high-performance computing and graphics processing. Huawei's servers, AI processors, and high-end mobile phones may gradually adopt HBM memory.

SMIC

As China's largest wafer foundry, SMIC has continuously made breakthroughs in advanced packaging technology, including the development and production capacity improvement of HBM packaging process.

YMTC

YMTC, which focuses on storage chips, has made significant progress in 3D NAND flash memory technology, and is also exploring the application of HBM technology to meet the needs of the high-performance storage market.

Zhiguang Group

Through its subsidiaries such as Ziguang Guoxin, Ziguang Group has actively laid out the high-bandwidth memory market and promoted the development and industrialization of HBM technology.

Sugon

As China's leading high-performance computing provider, Sugon has actively adopted HBM technology in the fields of supercomputers and data centers to improve system performance.

Research institutions and universities

Chinese Academy of Sciences

The Institute of Microelectronics and the Institute of Computing Technology under the Chinese Academy of Sciences have made important progress in the basic research and application development of HBM technology.

Tsinghua University

Tsinghua University has strong scientific research strength in the fields of microelectronics and computers, and has carried out a number of HBM-related research projects to promote technological innovation and talent training.

Peking University

Peking University's microelectronics research team has actively explored and carried out related research work in the fields of advanced packaging technology and high-bandwidth memory.

Industry Chain Collaboration

Materials and Equipment

China's material and equipment suppliers actively participate in the research and development of HBM packaging substrates, providing advanced materials and equipment support, such as silicon interposers, TSV process equipment, etc.

Packaging and Testing

Packaging and testing service providers continue to improve their process capabilities in HBM technology. Companies such as Huatian Technology and Tongfu Microelectronics already have some capabilities for HBM packaging.

Challenges and Future Outlook

Technical Challenges

Despite some progress, China still faces multiple challenges in HBM packaging substrate technology, such as high technical difficulty, complex processes, and cost control. In particular, in TSV manufacturing, chip alignment, thermal management, etc., continuous investment and technological breakthroughs are needed.

Market Competition

The global semiconductor market is highly competitive, and Chinese companies need to continuously improve their technical level and product quality to gain a foothold in the international market.

Talent cultivation

Advanced packaging technology requires a large number of high-level engineering and technical talents. China needs to increase its efforts in education and training to cultivate more professional talents.

Summary

China's R&D and industrialization in the field of HBM packaging substrates are in a rapid development stage, benefiting from the joint promotion of policy support, corporate investment and scientific research. In the future, through continuous technological innovation and industrial collaboration, China is expected to make greater breakthroughs in HBM technology and promote the development of high-performance computing and storage technology.