"GUS"? SMT processing typical capacitors

"GUS" SMT processing typical capacitors

SMT processing capacitor types are very complex, if the shape, structure and use of the various categories can be up to hundreds. Of course, the main commonly used capacitors in SMT processing are well classified, which can be roughly divided into chip porcelain dielectric vessels, electrolytic capacitors, aluminum electrolytic capacitors, organic film, mica capacitors, etc. In actual PCBA processing, the most commonly used are multilayer chip porcelain dielectric vessels. The following SMT SMT SMT processing manufacturers technology small series to give you an introduction to the actual PCBA processing commonly used in the typical capacitor - plate porcelain dielectric container.

1, structure,

SMT SMT processing of ceramic dielectric vessels with ceramic materials as capacitive medium. MLC (multilayer sheet ceramic capacitor) is constructed on the basis of a single-layer disc capacitor, with electrodes deep inside the capacitor and interlaced with ceramic media. MLC is usually a pin less rectangular structure, with the outer electrode being the same as the chip resistor, and also a three-layer structure, namely ag-ni/cd-sn /Pb. According to the usage, MLC can be divided into two types: type I ceramics (domestic model CC41) and type n ceramics (domestic model CT41). Class I ceramics are temperature-compensated capacitors characterized by low loss and high capacitance stability, suitable for resonance circuits, coupling circuits and circuits requiring temperature compensation. N-class ceramics are high dielectric constant capacitors, characterized by small volume and large capacity, suitable for bypass, filtering or frequency discrimination circuit with low requirements on loss and capacity stability.

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2. Overall size

The shape standard of the chip porcelain dielectric vessel is roughly the same as the chip resistor, which is still expressed by length X width.

At present, plate type porcelain dielectric vessels are usually not marked with any label, and the relevant parameters are marked on the plate. Up to now, there is still no uniform standard for labeling on the outer packaging of chip capacitors. Labels of different manufacturers are slightly different.

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