Graphic Electroplating

The graphic electroplating process is generally divided into the following links: electro-copper, electro-tin, film stripping, etching, and tin stripping. All these links are realized through chemical reactions.

Electric copper, electric tin

After the "circuit" is completed, the circuit board will first be sent to the graphic electroplating production line to complete the electrical copper and electrical tin.

We know that after the circuit is completed, copper has leaked out of the board where there is a circuit, and there is still a dry film where there is no circuit. After the electrical copper is completed, the leaked copper will be covered with another layer of copper to make the copper thicker. That is, where there are lines, a layer of copper will be added, including vias and electrical holes. The place blocked by the dry film will not be coppered.

After electro-tinning, there will be another layer of tin where there are lines. The tin here is not the tin on the circuit board we finally got. The tin here is a kind of liquid tin, and its function is in the next link.” To protect the circuit when "removing the film", it will disappear in the last link of the photoelectric process and complete its mission.

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