Good News! JoinSpire Sintered Silver Won the Excellence Award of the 15th China Innovation & Entrepreneurship Competition!!!

Good News! JoinSpire Sintered Silver won the Excellence Award of the 15th China Innovation and Entrepreneurship Competition (Shenzhen Division) and the Third Prize of "Longgang Mass Entrepreneurship Star"

On December 6, 2023, Guangdong Joinspire Technology Co., Ltd. won the 15th China Innovation and Entrepreneurship Competition (Shenzhen Division) (hereinafter referred to as "Shenzhen Division") with its entry project "High-Performance Power Semiconductor Packaging Materials Domestic R&D and Industrialization Project" "Creation Competition")

After months of fierce competition and layers of screening, Guangdong Joinspire Technology Co., Ltd. finally stood out among 7,852 projects in the region, passed all the way and entered the city finals, and finally won the "Shenzhen Innovation Competition" Enterprise Group Excellence Award.

Guangdong Joinspire Technology Co., Ltd. was established in February 2023 and was incubated by Shenzhen Jufeng Solder Co., Ltd., a national high-tech enterprise. It focuses on third-generation semiconductor chip packaging materials and solutions. With mature commercial nano-sintered silver series products, it fills the domestic gap and breaks the import monopoly. We are committed to promoting the development of domestic substitution of core semiconductor materials through leading technologies and solving the "stuck" problem of key materials.

The electrical and thermal conductivity and reliability of Joinspire sintered silver paste are far superior to traditional soldering materials, and it is considered the most reliable material for electronic and power packaging. It can provide internationally leading high-performance and high-reliability electronic device material solutions for electric vehicles, rail transit, smart grids, wind power, solar energy, white goods, aerospace, military industry, optical storage, photovoltaics and other industrial fields.

Longgang Mass Entrepreneurship Star

During the same period, Guangdong Joinspire Technology Co., Ltd. won the third prize of the Longgang Mass Entrepreneurship Star Award for its entry project "High-Performance Power Semiconductor Packaging Materials Domestic R&D and Industrialization Project".

Guangdong Joinspire Technology Co., Ltd. won the third prize of "Longgang Mass Entrepreneurship Star" after various selections including preliminary rounds, industry semi-finals, and industry finals.

Leaders of Shenzhen Municipal Science and Technology Innovation Commission, Longgang District Science and Technology Innovation Bureau, and other relevant departments attended the event and presented awards. More than 170 representatives from award-winning units, financial institutions, industry carriers, enterprises, and media participated in the event to witness the third "Longgang Mass Entrepreneurship Star" "The grand ceremony of the Innovation and Entrepreneurship Competition Awards Ceremony.

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