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Mark LaPedus的更多文章
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Setbacks Hamper U.S. Chip Manufacturing Efforts2024年2月21日
Setbacks Hamper U.S. Chip Manufacturing Efforts
The United States and several chipmakers are in the midst of a major strategic effort to boost the production of…
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3 条评论 -
Intel Pushes For New Mask Size2024年2月7日
Intel Pushes For New Mask Size
Intel is leading the charge to get the semiconductor industry to adopt a new photomask size standard, but the move…
40
4 条评论 -
Improving Reliability For GaN And SiC2020年6月19日
Improving Reliability For GaN And SiC
Why these chips are gaining ground, and what still needs to be addressed.
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EUV’s Uncertain Future At 3nm And Below2020年5月24日
EUV’s Uncertain Future At 3nm And Below
Manufacturing chips at future nodes is possible from a technology standpoint, but that’s not the only consideration.
14
1 条评论 -
Scaling CMOS Image Sensors2020年4月24日
Scaling CMOS Image Sensors
Manufacturing issues grow as cameras become more sophisticated.
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Metrology Challenges For Gate-All-Around2020年4月21日
Metrology Challenges For Gate-All-Around
Why future nodes will require new equipment and approaches.
25
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Making Chips At 3nm And Beyond2020年4月17日
Making Chips At 3nm And Beyond
Lots of new technologies, problems and uncertainty as device scaling continues.
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How And Where Machine Learning Is Being Used In IC Manufacturing2020年4月1日
How And Where Machine Learning Is Being Used In IC Manufacturing
https://semiengineering.com/issues-with-machine-learning-in-fabs/
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