Gold-tin (AuSn) Alloy Solder Paste

Gold-tin (AuSn) alloy solder paste Au80Sn20, also write as 80Au20Sn. It consists of an alloy of gold and tin elements.

The melting point of gold-tin solder is 280°C. It has excellent thermal and electrical conductivity, high tensile strength, high reliability, good wetting performance, corrosion resistance, and compatibility with other precious metals. It has been widely used in aerospace and military industries. , medical, optical communications, BGA (ball grid array packaging), CSP (chip size packaging), and gradually become the mainstream of advanced packaging such as Filp-Chip, SIP, WLCSP, and MEMS.

Advantages:

• High melting point 280℃, eutectic melting point,
• low Coefficient Of Thermal Expansion (CTE)
• superior thermal conductivity
• superior tensile strength
• superior electrical conductivity
• Excellent wettability, Available for dispensing and pin transfer
• Easily able to form electrode bumps

Gold-tin solder paste is usually used in situations where a high melting point (over 150°C), good thermal fatigue properties, and high strength at high temperatures are required, or where high tensile strength, corrosion resistance, and oxidation resistance are required, as well as in subsequent low-temperature reflow. The solder joints will not melt during the welding process.

Gold-tin solder paste products have consistent printing performance, good repeatability, and long shelf life on the stencil, and can fully meet the challenges of high-speed, high-mix surface mount.

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