Gold Plating Thickness in Interconnects
Connectors typically come with either a tin plating or gold plating. Determination can be made among many based on environment, insertion/extractions and applications with low voltages and currents.??
With the increasing price of gold in the 1970s and 1980s, the connector industry, the initial standard gold thickness of 2.5 um (100 microinches) was gradually reduced until gold flash over nickel was proposed as the ultimate cost reducer.?For decades, manufacturers of electronics products have used gold plating to protect the connectors that are essential for joining electrical circuits together. Gold is the preferred material because of its good electrical conductivity, ability to resist corrosion and wear. Determining the appropriate gold plating thickness can be a vital decision to maximize the durability and life cycle of the connector.
The thickness of gold plating can vary significantly.?It’s possible to apply a gold coating ranging typically from 4uin to 100uin. While a thicker layer will decrease the workpiece’s porosity and enhance corrosion protection, a coating that’s too thin may not provide sufficient corrosion and wear resistance.
Cost is a huge factor when considering the ideal gold plating thickness. As a precious metal, gold can be one of the most expensive plating materials, which may result in a higher project cost. As a rule of thumb, start with a thickness level that’s as low as possible for your application, then increase it if necessary.
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It may seem difficult to determine the right thickness for gold plating connectors and contacts. Connectors must perform reliably even under harsh conditions, and they can only do so when the plating is properly designed with the right amount of thickness. As an added factor, gold can be an expensive material to procure, meaning it’s important to only make plating as thick as it needs to be — thicker than needed means wasted money.