Gen AI, HPC to fuel HBM market growth - February 2024
The market for high bandwidth memory (HBM) is poised for rapid growth over the next five years, announces Yole Group in its latest analyses.
According to the analysts, it is led by the continuous expansion of data-intensive artificial intelligence (AI) and high-performance computing (HPC) applications. As a result, the HBM sector will largely outgrow the overall DRAM market and remain undersupplied throughout 2024.
What are the latest innovations? What impact will they have on the ecosystem? Simone Bertolazzi and Emilie Jolivet , respectively Principal Analyst and Director, More Moore activities at Yole Group offer you today a snapshot of this industry.
This article is based on the key results of the Next-Generation DRAM 2024 – Focus on HBM and 3D DRAM report published this month.
The rapid rise of generative AI has boosted demand for high-speed DDR5 DRAM and HBM technologies in the data center market. AI workloads are driving the need for higher bandwidth to increase data transfer rates between devices and processing units.
Yole Group estimates that following an impressive 93% year-on-year increase in bit-shipment growth, data center DRAM bit demand could grow at a compound annual growth rate (CAGR) of 25% in 2023-2029, driven by a 39% growth in DRAM for AI servers over that period.
HBM revenue surge: Yole Group’s confirmed analysis…
The rapid rise of generative AI has boosted demand for high-speed DDR5 DRAM and HBM technologies in the data center market. The share of HBM in overall DRAM bit shipments is forecast to rise from 2% to 9% between 2023 and 2029, as AI server demand outpaces other applications. But as HBM technology is priced significantly higher than DDR5, in revenue terms the share is anticipated to climb from $14 billion in 2024 to $38 billion in 2029…
With Yole Group’s Memory experts as Simone Bertolazzi, Emilie Jolivet and John Lorenz, the company unveils market insights daily.
Don't miss out on the latest analyses and stay tuned!
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