Future trends of coreless packaging substrate manufacturing

1. Overview of coreless packaging substrates

Coreless packaging substrates are high-density interconnect substrates without traditional core materials. This design allows the substrate to achieve thinner thickness and higher wiring density. Compared with traditional core packaging substrates, coreless packaging substrates have lighter and thinner structures, higher electrical performance and higher design flexibility, and are suitable for high-performance and high-density electronic components.

2. Manufacturing process of coreless packaging substrates

The manufacturing process of coreless packaging substrates mainly includes the following steps:

Layering process: Since coreless substrates do not have traditional core materials, multi-layer film stacking is usually used during manufacturing, and a multi-layer structure is formed by repeated stacking and lamination. This process can achieve extremely high wiring density and adapt to smaller component packaging sizes.

Laser drilling and fine lines: Laser drilling technology plays a key role in coreless substrates, which can achieve extremely small apertures and fine wiring structures. This is essential to support high-speed signal transmission and high-density interconnection.

High-precision etching and plating: The design of Coreless substrates requires extremely high precision during line etching and plating to ensure signal integrity and electrical performance.

Application of thin film materials: In order to achieve coreless structure, Coreless packaging substrates usually use high-performance thin film materials, which need to have good mechanical strength, thermal stability and electrical insulation performance.

3. Application products and industry needs of Coreless packaging substrates

Coreless packaging substrates have a wide range of applications, mainly concentrated in the following high-end industries and products:

1. High-performance computing Coreless packaging substrates have been widely used in the field of high-performance computing, especially for chip packaging such as central processing units (CPUs) and graphics processing units (GPUs) that require extremely high wiring density and signal integrity. Since these processors need to process large amounts of data and high-speed signal transmission, the high electrical performance and thin and light design of Coreless substrates can effectively improve the overall performance and heat dissipation efficiency of the system.

2. Mobile devices As mobile devices such as smartphones and tablets develop towards lighter, thinner and more powerful performance, Coreless packaging substrates have become an ideal choice for packaging substrates for these devices because they can support higher wiring density and reduce packaging thickness. In addition, the application of Coreless substrates can also improve radio frequency (RF) performance, which is essential for supporting 5G communications.

3. Communication equipment In communication equipment such as 5G base stations and high-speed routers, Coreless packaging substrates can meet the needs of high bandwidth and low latency with their excellent high-frequency characteristics and low loss performance. This makes Coreless substrates an important part of 5G infrastructure and high-performance network equipment.

4. Automotive electronics With the development of intelligent driving technology, automotive electronic systems need to process large amounts of data and real-time communications, and the requirements for PCBs are getting higher and higher. The application of Coreless packaging substrates in the field of automotive electronics is mainly reflected in vehicle control systems and advanced driver assistance systems (ADAS). These systems require high reliability and high electrical performance, and the application of Coreless substrates can effectively improve the stability and safety of the system.

5. Wearable devices The demand for thinness and functional integration of wearable devices has driven the application of Coreless packaging substrates. Such devices usually need to integrate multiple functional modules in a very small space. Coreless substrates can provide higher wiring density and smaller size, which helps to achieve miniaturization and lightweight of products.

4. HOREXS's layout in the field of Coreless packaging substrates

As a semiconductor packaging substrate manufacturer with more than 15 years of experience, HOREXS has established its own competitive advantages in the field of Coreless packaging substrates. The company adopts advanced manufacturing processes, such as mSAP technology, so that the Coreless packaging substrates it produces have extremely high wiring density and electrical performance, which can meet the needs of high-end electronic products.

HOREXS's Coreless packaging substrates are mainly used in high-performance computing, 5G communication equipment and automotive electronics. The company continuously optimizes product performance and improves production efficiency by cooperating with the world's leading OSAT (Outsourced Semiconductor Assembly and Test) companies. In addition, HOREXS also focuses on green production and traceability to ensure that its Coreless packaging substrates meet the standards of sustainable development while meeting high technical requirements.

5. Future trends of Coreless packaging substrates

1. High integration and miniaturization As electronic products develop towards high integration and miniaturization, the application of Coreless packaging substrates will continue to expand. In the future, as the complexity of chip packaging increases, Coreless substrates will become the core component of high-end packaging solutions, especially in cutting-edge technology fields such as 5G, artificial intelligence (AI), and the Internet of Things (IoT).

2. Application of new materials In order to further improve the performance of Coreless packaging substrates, the development and application of new materials will become an important trend in the future. High-frequency and high-speed materials, low-loss materials, and environmentally friendly materials will become the focus of research, which will further improve the electrical performance and reliability of substrates.

3. Intelligent manufacturing and automation As the complexity of the manufacturing process of Coreless packaging substrates increases, intelligent manufacturing and automation will become necessary. In the future, companies will achieve more efficient production and more refined quality control by introducing artificial intelligence (AI), big data analysis, and automated production lines. This will help reduce production costs and improve product consistency and reliability.

4. Optimization of the global supply chain Against the backdrop of the gradual recovery and reorganization of the global supply chain, Coreless packaging substrate manufacturers will pay more attention to the resilience and diversification of the supply chain. Companies will reduce the risk of supply chain disruptions and ensure the continuous supply of products through localized production and diversified supply chain layout.

5. Environmental protection and sustainable development As the world pays more attention to environmental protection and sustainable development, Coreless packaging substrate manufacturers will pay more attention to the application of green production technology. In the future, low carbon emissions, resource conservation and the application of environmentally friendly materials will become important directions for the development of the industry. HOREXS has made efforts in this field. Its production plants meet green production standards and fully implement MES and ERP systems in the product manufacturing process to achieve full traceability and environmental management.

6. Conclusion

Coreless packaging substrates have become an indispensable basic component of modern high-end electronic products due to their unique coreless design and superior electrical performance. With the continuous advancement of technology and the continuous growth of market demand, Coreless packaging substrates will be widely used in more fields. As an industry-leading semiconductor packaging substrate manufacturer, HOREXS has made remarkable achievements in the field of Coreless packaging substrates with its advanced process technology and continuous innovation capabilities, and will continue to lead the industry development in this field.

In the future, with the development of high-performance computing, 5G communications, automotive electronics and other fields, the demand for Coreless packaging substrates will continue to increase. Enterprises need to continue to invest in technological innovation, intelligent manufacturing and supply chain management to cope with increasingly fierce market competition. HOREXS will continue to uphold the concepts of green production and sustainable development, and continuously enhance its competitiveness and market share in the Coreless packaging substrate market through technological innovation and market expansion.