Full Program: Agenda, Masterclasses, and Exhibition Floor at the The Future of Electronics RESHAPED USA

12 & 13 June 2024 | Boston | Conference and Exhibition

Below you can explore the full progrom including conference agenda, exhibition floorplan and masterclasses

Register before the early bird ends on 10 May

Agenda

12 June | Keynote Presentations

9:00 AM | TechBlick | Welcome & Introduction?

9:05 AM | 旭化成 | Development of Smart Logistic Solution Using Flexible Sensor with R2R Submicron Electrode Formation Technology | 阿部誠之

9:25 AM | Energy Materials Corporation | Commercializing High-speed Production of Perovskite Solar Panels? Thomas Tombs

9:45 AM | Voltera | Multi-layer Flexible Displays using Electroluminescent Ink? Jesus Zozaya

10:05 AM | FLEXOO | Mass customization & mass production of Smart Sensors Jean-Charles Flores

Lunch & Exhibition Break

12 June | Track 1

11:15 AM | GE航空 | Printed Electronics for Embedded RF Die Packaging Felippe Pavinatto

11:35 AM | Akoneer | Semiconductor Packaging With Selective Surface Activation Induced by a Laser (SSAIL): Technology and Applications* Tadas Kildu?is

11:55 AM | Holst Centre | Additive manufacturing for 3D structural microelectronics? Hylke B. Akkerman

12:15 PM | NanoPrintek, Inc. | Dry Multi-material Printing Technology: Efficient, Clean, Cost-Effective, and Supply-Chain Resilient Masoud Mahjouri-Samani, PhD

Lunch & Exhibition Break

2:05 PM | Kateeva | Billions of drops per second, where do you want them? Kent Ubellacker

2:25 PM | Komori America Corporation | Minimum Solder Paste Bump Size using Gravure Offset Printing for Micro LEDs Doug Schardt

2:45 PM | Quantica | Beyond Thin Layers: High Viscosity Solutions for Printed Electronics Shahzad Khan, PhD

3:05 PM | Notion Systems | Advanced Patterning with EHD and Inkjet Max Mosberg

Lunch & Exhibition Break

4:10 PM | VTT | Advancing printed and hybrid electronics from concepts to pilot factory manufacturing Antti Kemppainen

4:30 PM | Raytheon | Printed Hybrid Electronics (PHE) Manufacturing: Pathways to Next-Gen Electronics @Daniel Hines

4:50 PM | CondAlign AS | Room temperature electronics bonding in FHE applications, addressing sustainability and cost P?l Morten Lindberget

5:10 PM | Northrop Grumman | Advanced Electronics for Space Systems of the Future @Andrew Kwas

Register before the early bird ends on 10 May

12 June | Track 2

11:15 AM | Linxens | Merging technologies for tomorrow’s medical wearables Alix Joseph

11:35 AM | TracXon | Trillion-Sensor Economy Enabled by Printed Electronics Ashok Sridhar, PhD MBA

11:55 AM | Spark Biomedical Inc | Printing 3D In-Ear Sensors: Technological Innovations* Alejandro Covalin

12:15 PM | GE医疗 | Sustainability in single-use medical sensors/devices Gurvinder Singh Khinda

Lunch & Exhibition Break

2:05 PM | Copprint | Copper Conductive Inks: Meeting the conductivity, cost, and scale challenges* Brian Bischoff

2:25 PM | 美国卡内基梅隆大学 | Soft & Stretchable Electronics with Liquid Metal Carmel Majidi

2:45 PM | C3Nano, Inc. | Ultrathin and Ultra conductive Transparent Inks: From Conformal to 3D Electronics* Ajay Virkar

3:05 PM | Heraeus Electronics | Functional electronic inks as an enabler for the latest advancements in healthcare @Gregory Berube

Lunch & Exhibition Break

4:10 PM | Myant | How do humans fit into the future? Ilaria Varoli

4:30 PM | PARC / @SRI international | Textile-based Audio Recording System Nicole DiLello Heidel

4:50 PM | Advanced Functional Fabrics of America (AFFOA) | Democratizing the Toolkit for E-textile System Integrators Michelle Farrington n

5:10 PM | SunRay Scientific Inc. | Fine-Pitch Direct Die Attach Without Thermal Compression: Heterogenous Packaging, Wearable Electronics, and FHE* John Yundt

Register before the early bird ends on 10 May

13 June | Track 1

9:00AM | Lockheed Martin | Flex Integration for Edge Computing? Isaac Leffler

9:20 AM | Antenna Research Associates, Inc. | Additive Large Area Conformal Electronics Manufacturing @John Haven

9:40 AM | 伊士曼柯达 | Flexible Heaters Manufactured Using High-Resolution Flexography Carolyn Ellinger

10:00 AM | Intellivation | Integrated R2R Platform for Development and Production of High-Tech Flexible Electronics Mike Simmons

Lunch & Exhibition Break

11:10 AM | Sefar Inc. | Pushing production-level screen printing to the sub-20micron region: screen making innovations* Dan Gilsdorf

11:30 AM | INO SD Print | Revolutionizing Small Batch Printing: High Productivity with Innovative Screen Printing Technology Nives Vehar

11:50 AM | Brewer Science | Printed Electronics for Air and Water Quality Measurements* Adam Scotch

2:10 PM | 伊顿 | Printed Power Module Sai Guruva R Avuthu

Lunch & Exhibition Break

2:00 PM | Ligna Energy | R2R manufactured supercapacitors for self-powered electronics Peter Ringstad

2:20 PM | Coatema Coating Machinery GmbH | Tech Pillars of the green hydrogen economy – how to scale the production methods for PEM fuel cells from Lab2Fab Thomas Kolbusch (THE coating expert)

2:40 PM | Smartkem | TBC

Register before the early bird ends on 10 May

13 June | Track 2

9:00AM | Panasonic | Biometric Sensor Manufactured with Novel Soft Circuit Board Technology? Tomohiro Fukao

9:20 AM | East West Manufacturing | Mass producing wearable biosensors Mark A. Duarte

9:40 AM | Inteva Products | Challenges of Smart Surfaces in Automotive Trim Jeremy Husic

10:00 AM | Boeing | TBC

Lunch & Exhibition Break

11:10 AM | nano3Dprint | Printed Electronics: Engineering the Future in 3D? Ramsey Stevens

11:30 AM | @Advanced Printed Electronic Solutions | 3D Printed Electronics Applications @Rich Neill

11:50 AM | XTPL | Solution for printed microelectronics. Next generation of resolution in additive technology* Ludovic SCHNEIDER

12:10 PM | Hummink | Unveiling the Smallest Fountain Pen in the World Frederic Raynal

Lunch & Exhibition Break

2:00 PM | Integrated Deposition Solutions, Inc. (IDS) | Additive 3D printed electronics with ultrafine resolution with aerosol: advances and applications* David Keicher

2:20 PM | ImageXpert | New Technologies to Aid the Development of Printed Electronics Kyle Pucci

2:40 PM | SUSS | Inkjet printing for functional applications Dennis Kuppens

13 June | Closing Presentations

3:40 PM | MAASS | Our Path to a Scalable, Multi-Material AM Solution? JF Brandon

4:00 PM | Pragmatic Semiconductor | Agile Semiconductor Manufacturing: FlexIC’s Impact on Semiconductor Industry Resilience Vincent Barlier

4:20 PM | Nano OPS, INC. | Additive Manufacturing of Electronics at the Nano, Microscale for 3D Heterogenous Integration for Advanced Packaging Ahmed Busnaina

?Register before the early bird ends on 10 May

The exhibition booths are all sold-out with a awaiting list of 20+ companies. ?Attendee places too are in high demand so we recommend booking soon to guarantee your place. Explore the exhibition floor here

?Masterclass Program:

instructors include Alan Brown Michael Dickey Christophe Sansregret Tuomas Happonen John Crumpton Dr. Martin Hedges Charlotte Kjellander Mark D. Poliks