Fueling the Photonics Revolution: Europe's Innovators Drive Advancements in Integrated Circuit Packaging

The photonic integrated circuits (PICs) field has seen significant growth in recent years, enabling applications in data communications, sensing technologies, and LiDAR systems. However, efficient packaging solutions are essential to fully unlock the potential of integrated photonics.

Packaging involves various techniques to improve signal and power distribution, enhance optical performance, manage thermal effects, and provide protection to the devices. It includes processes like die bonding, polishing, active alignment, and hermetic sealing.

Let's delve a bit deeper into the different players and their contributions to the field of photonic integrated circuit (PIC) packaging in Europe.

APP ( PIXAPP Pilot Line ): APP is a pilot line that aims to bridge the gap between academic and commercial production in the field of photonic packaging. They offer a range of services, including training, access to state-of-the-art equipment, and development of packaging standards based on design rules. With a focus on high-risk development and early-stage prototyping, APP supports the advancement of packaging technology for scalable manufacturing. Through their efforts, they facilitate the development of a robust supply chain for PIC packaging.

PHIX Photonics Assembly : As a packaging partner of PIXAPP, PHIX specializes in offering flexible and adaptable standard packages for prototype packaging. They provide custom RF interfacing boards, which facilitate the integration of electrical and optical functionality. PHIX also maintains a stock of standardized housings for volume packaging, which eliminates the need for minimum order quantities and upfront housing design costs. This approach enables faster and more cost-effective packaging solutions for PICs.

AT&S : AT&S is a European company that focuses on the interconnection of photonic chips with a high number of electrical and optical interfaces. They adopt a co-engineering approach, which involves considering packaging requirements during the early stages of PIC fabrication. By integrating design and packaging considerations, AT&S ensures optimal performance and reliability of PICs. They specialize in the development of interposer-based packaging solutions, which enable efficient electrical and optical coupling between the chip and the external world.

vario-optics : Vario-optics is another company that emphasizes the interconnection of photonic chips. They rely on electro-optical circuit boards (EOCBs) to achieve efficient electrical and optical coupling. EOCBs are customized circuit boards that integrate electrical traces and fiber arrays, enabling easy integration of PICs into larger assemblies. Vario-optics' packaging platform is designed to be flexible and adaptable, accommodating different PIC designs and enabling rapid prototyping and high-volume manufacturing.

Nanoscribe : Nanoscribe, a German company, specializes in developing 3D microfabrication systems for high-resolution printing of polymer microlenses on photonic chips. By leveraging their technology it becomes possible to create custom microlenses with geometries and characteristics, enhancing the performance of the integrated photonics devices. The ability to print microlenses directly onto PICs simplifies the assembly process and improves optical coupling efficiency.

ficonTEC : ficonTEC is an equipment manufacturer that focuses on assembly and testing machines for photonic-enabled devices. Their equipment offers advanced alignment and bonding capabilities, enabling the precise assembly of complex integrated photonic circuits. ficonTEC's solutions are crucial for achieving the required alignment accuracy in PIC packaging, ensuring efficient coupling of light signals and optimal device performance.

Yelo Photonics : Yelo, a Northern Ireland-based company, specializes in testing the long-term reliability of laser diodes. Laser diodes are crucial components in many photonic integrated circuits and their long-term reliability is essential for device performance. Yelo's testing equipment allows for accelerated life testing and stress testing of laser diodes, helping manufacturers ensure the reliability and durability of their integrated photonics devices.

Based in France, ICON Photonics specializes in chip-to-fiber interconnect technology using polymers. They prioritize high densities, faster speeds, and wafer-level packaging. By integrating photonics, electronics, and mechanics at the wafer level, ICON Photonics offers a complete solution that caters to various applications. Their offerings include mechanical fixtures for self-alignment and attachment, polymer micro-optics for efficient light coupling, and embedding of active devices like detectors, lasers, and sensors. Additionally, their silicon interposers offer RF and millimeter-wave transmission lines to further enhance their packaging capabilities.

These companies, along with various research organizations and academic institutions, are driving the development of advanced packaging solutions, standardized packaging platforms, 3D microfabrication techniques, and improved testing methodologies. Together, they contribute to the growth and adoption of photonic integrated circuits across diverse industries.