FRDM-IMX93 Development Board with On-Board IW612 Wi-Fi 6 Tri-Radio Module
NXP expanded its FRDM ecosystem with the launch of the FRDM-IMX93 Development Board based on the i.MX 93 Applications Processor. Not only is this the first FRDM board based on an i.MX MPU, but also it is the first FRDM board to come equipped with a built-in Wi-Fi module, featuring the IW612 Wi-Fi 6 Tri-Radio solution.
Connected Solutions with Wi-Fi + MPU on the FRDM Platform
NXP enables boundless innovation through the FRDM platform by combining a hardware portfolio—MCUs/MPUs, analog, connectivity—with comprehensive software tools to bring flexibility and accessibility to solutions across the Industrial and Consumer markets. With the latest release of the FRDM-IMX93 board, NXP pairs the i.MX 93 Applications Processor with the IW612 Wi-Fi 6 Tri-Radio solution to simplify the development experience of a connected Wi-Fi + MPU solution.
The connected platform created with the i.MX 93 and IW612 Wi-Fi 6 Tri-Radio is supported by a Radio Co-Processor (RCP) architecture. In the RCP architecture, the network stack runs on the host processor which allows for high radio performance and wireless throughput. This solution is optimal for a wide variety of applications such as building control, cameras and security, home EV charging, and smart home hubs and appliances.
NXP has invested heavily in supporting the software for the full portfolio of Wi-Fi devices within the software packages for the i.MX Applications Processors, which includes integrating a single, scalable Wi-Fi driver supporting all NXP Wi-Fi devices into the Linux and Android BSPs. NXP performs the functionality and integration tests, providing software solutions that are already validated.
High-Performance IW612 Wi-Fi 6 Tri-Radio Solution
The IW612 is a Tri-Radio wireless solution supporting Wi-Fi 6, Bluetooth/Bluetooth LE and IEEE 802.15.4. This device features a 1x1 dual-band 2.4 GHz / 5 GHz Wi-Fi 6 radio subsystem, providing high throughput and bandwidth, improved network efficiency, extended range and lower latency over previous Wi-Fi generations. The IW612 also includes a Bluetooth/Bluetooth LE and IEEE 802.15.4 radio subsystem that enables a high-speed data rate of 2 Mbit/s, long range, extended advertising and LE audio as well as Thread, Zigbee and Matter support.
To connect the i.MX 93 or any other host processor, the IW612 and its supported modules come with SDIO 3.0 for Wi-Fi, UART for Bluetooth, and SPI for 802.15.4.
With robust and reliable connectivity, advanced internal and external multi-radio co-existence, and a high level of integration, the IW612 provides an optimized solution for a wide variety of Industrial and IoT, Smart Home and Building, Smart Appliances and Energy applications.
For a better experience, download the block diagram.
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NXP Partner Modules
Soldered onto the FRDM-IMX93 is the u-blox MAYA-276-00B Wi-Fi module based on the IW612. This module features a dual-antenna configuration with one Wi-Fi U.FL connector and one Bluetooth U.FL connector. The MAYA-W2 module family offers multiple antenna options (single embedded PCB/pin or dual U.FL/pin), low power consumption, secure boot and secure OTP, and an array of certifications (FCC/ISED/RED/UKCA/GITEKI/KCC/NCC).
NXP partners with u-blox and other leading module manufacturers who design modules based on NXP wireless solutions. Certain module partners also provide design support and custom software.
The complexities of Wi-Fi design—which can include antenna selection, equipment investment, RF tuning, testing, certification and more—pose a challenge for most designers. However, using a Wi-Fi module can mitigate these challenges, bringing pre-tested and compliant solutions as well as time to market advantages and cost effectiveness.
Getting Started
Quick and flexible prototyping of the i.MX 93 Applications Processor and IW612 Wi-Fi 6 Tri-Radio is made possible by the FRDM-IMX93. Developers can get started building wireless solutions with the onboard u-blox MAYA-W2 Wi-Fi module and the enablement provided by the FRDM ecosystem.
Author | Haley Vu
Haley Vu is a Wireless Connectivity Product Marketer specializing in Wi-Fi, Bluetooth, and 802.15.4 solutions for Industrial and IoT applications. Drawing on her experience with the NXP Technical Sales Team, Haley brings support and enablement to the broad Mass Market. She holds a B.S. in Electrical Engineering from UC Davis and is based in the Silicon Valley.
Software Engineer at NXP Semiconductors
2 周Excellent board!
FAE Processor-Wireless (Edge Processing-AIoT)
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