Fraunhofer IZM future packaging line includes Essemtec solder jet printing technology
Future Packaging Joint Booth –"The Line" at SMTconnect 2022 - Hall 5 Booth 434A
It’s expo time! Finally! SMTconnect 2022 might be starting under bumpy conditions, but the widespread and fervent enthusiasm for networking in person again after three years of abstinence was unmistakable. The last three years have seen a myriad of new developments in production machinery, components, processing materials, and technology, and no one wants to miss out on this opportunity to catch up on the current state art. Some of the most striking advancement has been in virtualization technologies for manufacturing workflows, technologies, and processes. For a comprehensive overview of this new technology landscape and advice on the possibilities for your specific production requirements, head to the Future Packaging Line. The Fraunhofer IZM team organizing the line has chosen virtualization as this year’s key research focus, and is planning the line around the theme "Digital Twin".
2022 Booth Concept: Topic "Digital Twin"
The focus of this year’s booth will be on embedding the line concept in a virtual environment. Particularly we will be emphasizing the potential of continuous communication between virtual production processes and their real-life counterparts. Another focus is the move from Industry 4.0 solutions to the digital twin approach.
The Future Packaging Joint Booth is a great example of industry and research working together efficiently. Its live production line provides a unique glimpse of the manufacturing process and the technologies that make it possible. Visitors get to judge the performance of the machines for themselves by seeing them in operation in an environment that mimics actual manufacturing conditions. The booth also showcases a wide range of exhibitors, including research institutes, machine manufacturers, and component suppliers.
This production line includes Essemtec solder jet printing technology.
Essemtec shows in this line the spider solder jet printer, glue jetter, and other material dispenser. The SMT devices are getting more complex and smaller. 0201 and 0402 will soon be the norm. On the other hand, European production must become even more efficient to stay competitive.
To meet today’s market requirements and stay competitive, production companies must master high-mix, low-volume (HMLV). Production operations with a wide variety of products combined with low volume and low batch sizes mean complex assembly processes and elaborate preparation for processing. Frequent transitions between products and variants necessitate changing over setups quickly and efficiently. Our technology for this purpose is state-of-the-art and easily integrated into any line. We have available a wide range of dispensing applications, including solder paste and SMT glue, LED encapsulation, silver epoxy, dam and fill, underfill, cavity fill, 3D dispensing via laser height mapping, and heating. The system is powered by the user-friendly, intuitive software ePlace, and comes out of the box equipped with a variety of interface standards for Industry 4.0.