Force Behind Advanced Metrology and Inspection in Semiconductor Industry

The growing use of machine learning (ML) and artificial intelligence (AI) in metrology and inspection, combined with the widespread use of cutting-edge packaging technology, is driving demand for advanced metrology and tools in semiconductor inspection capable of checking these sophisticated packages. The development of novel metrology and inspection methods for sophisticated packaging, including fan-out wafer-level packaging (FOWLP) and system-in-package, is creating a significant demand in advanced technologies for metrology and inspection devices for packaging solutions.

The use of smart data analytics, artificial intelligence, and machine learning in metrology systems to address all aspects of metrology, including image and data analysis, inference, integration with modeling and simulation, predictions, and correlations to wafer process steps. Machine learning would play a significant role in metrology due to its advantage of measuring multiple parameters while covering large areas rapidly.

The transition to 2.5D and 3D packaging creates significant challenges for metrology and inspection tools. In the field of advanced packaging, hybrid bonding is a very powerful area with a significant inflection in which bonding wafers require precise planarization and polishing, leading to increased CMP metrology requirements for integrated and standalone OCD solutions.

Metrology and inspection needs at critical nodes are increasingly impacted by the broad range of new structures in fabs. These include SiGe/Si stacks in 3D nanosheet transistors, fully depleted silicon on insulator (SOI) devices, new backside power delivery methods, and chip stacking technologies enabled by hybrid bonding.

Key Regions Investing Heavily in the Market

Major countries such as Taiwan, South Korea, the United States, Japan, and China are investing heavily in the semiconductor fabrication and process industry.

In 2023, China has significantly ramped up its investments in the semiconductor industry as part of its strategic push for self-sufficiency. Since 2014, China's investments in semiconductor development have exceeded USD 150 billion, with the country's National Integrated Circuit Industry Investment Fund ("Big Fund") playing a central role. By 2021, China had invested approximately USD 73 billion in domestic semiconductor companies alone.

In recent years, China's commitment to semiconductor self-reliance has intensified, with new rounds of funding. In 2023, a third Big Fund was created, with a substantial USD 47.5 billion allocated to accelerate the country's chip development capabilities. Despite US sanctions and technological limitations, China remains committed to building out its domestic capabilities, focusing on areas such as advanced node manufacturing and memory chip production.

Leading Companies in the Semiconductor Metrology and Inspection Market

Key players shaping the semiconductor metrology and inspection landscape include 科天 , 应用材料公司 , 康代 ASML , レーザーテック株式会社 , Onto Innovation , Saki Corporation Ltd. , 赛默飞世尔科技 ., Hitachi High-Tech Corporation , Marposs , Chroma ATE Inc. , CyberOptics , Nikon , and among others.

Recent Technological Advancements

KLA Corporation unveiled a groundbreaking product, the Axion T2000 X-ray Metrology System. This system is a significant advancement for manufacturers of advanced memory chips, offering a new level of process control for the production of advanced 3D NAND and DRAM devices.

Meanwhile, Lasertec Corporation also introduced the CIRIUS Series. This system is a high-sensitivity under-layer defect inspection and review system, designed to meet the evolving needs of three-dimensional IC chip manufacturing.

Analyst Viewpoint

The semiconductor industry is currently passing through a very important and new stage that is in a state of turmoil because of the quick competition and the strategic investments made in the key regions of Taiwan, South Korea, China, the United States, and Japan. However, alongside these regions, the integration of machine learning and artificial intelligence in metrology and inspection technologies is the key factor, especially in some of the complicated technologies like fan-out wafer-level packaging (FOWLP) and system-in-package solutions for the automobile electronics businesses.

Within the context of the intense competition environment, corporations like KLA Corporation, Applied Materials, Inc., ASML Holding, and others are finding new and innovative ways to keep their leadership in the market. Innovative products and services like KLA Corporation's Axion T2000-X-ray Metrology System and Lasertec Corporation's CIRIUS Series prove quite clearly that it is the driving factor of the industry towards excellence of production and technology.

Despite encountering difficulties in adhering to the ever-changing manufacturing standards, the industry's stability; flexibility in embrace of adaptability, and innovative approach is of utmost importance on the means to attaining continual growth. The competition has exploded, and the keys to success in the semiconductor sector are collaboration and innovation.