Flyking Weekly Express 2025-02-24
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Samsung: 4nm Yield Improvement & Smartphone Production Shift
Samsung has reportedly improved its 4nm advanced process yield to nearly 80%, securing ASIC foundry orders from Chinese companies. This strengthens its position in the semiconductor market and lays the groundwork for 2nm mass production. Additionally, Samsung is evaluating significant changes in its smartphone supply chain, considering relocating production outside China in response to U.S. tariff measures.
Intel Announces 18A Process Readiness
Intel has updated its website, stating that its 18A process node is ready for customer projects, with production set to begin in the first half of the year. The 18A process aims to compete with TSMC’s top-tier technologies and bring Intel Foundry Services (IFS) into the mainstream market. While specific partners remain undisclosed, companies like Broadcom are actively pursuing collaborations.
Infineon Secures €1 Billion EU Subsidy
Infineon has made significant progress on its 200mm SiC product roadmap and plans to deliver its first advanced SiC products in Q1 2025. These will serve high-voltage applications in renewable energy, rail transport, and EVs. The EU has approved nearly €1 billion in funding for Infineon’s smart power factory in Dresden, Germany, which began construction in March 2023 and is expected to reach full production capacity by 2031.
NVIDIA’s Blackwell GPU Demand Soars
NVIDIA’s latest Blackwell architecture GPUs are seeing strong demand, with the company securing over 70% of TSMC’s CoWoS-L advanced packaging capacity for the year. Shipments are increasing by over 20% per quarter, driving TSMC’s operations. The surge in demand highlights continued AI chip expansion, with major cloud service providers aggressively increasing orders.
ADI Reports Demand Recovery
Analog Devices (ADI) announced its Q1 2025 financial results, reporting $2.423 billion in revenue. Growth in industrial, automotive, and communications sectors contributed to a quarter-on-quarter increase, while the consumer segment showed double-digit year-over-year growth. ADI remains confident in its 2025 recovery trajectory.
Murata Considers Production Shift to India
Murata is exploring relocating part of its production to India as customers push for greater supply chain diversification. Currently, 60% of Murata’s MLCCs are manufactured in Japan, but this share is expected to decline to around 50% in the coming years.
ST Enters Silicon Photonics, Partners with AWS on AI Chip
STMicroelectronics is expanding into silicon photonics to address the growing performance and efficiency demands of AI computing. The company plans to introduce 800Gb/s and 1.6Tb/s optical modules, with mass production slated for later this year. Additionally, ST is collaborating with AWS to develop a new computing chip targeting AI data center applications.
MediaTek to Launch Dimensity 9400+
MediaTek plans to release the Dimensity 9400+ chip in April, featuring a Cortex-X925 core clocked at 3.7GHz—the highest frequency in Dimensity history. The chip, fabricated using TSMC’s 3nm process, maintains the same architecture as the Dimensity 9400 and is expected to deliver top-tier smartphone performance.
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