Flyking Weekly Express 20230612
NXP Is Tightly Controlling Supply & Orders
NXP is tightly controlling supply and orders, requiring all orders to be submitted directly to NXP, not to distributors. Therefore, delivery dates can only be confirmed directly by the manufacturer. However, lead times are not guaranteed and are for reference only
Intel Researchers Claim to Be Two Years Ahead with Breakthrough PowerVia Tech
Intel researchers claim to be a year ahead of the curve in developing a breakthrough power technology for chips known as PowerVia.
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A test chip showed that PowerVia could deliver 90 percent cell utilization, enabling the chip to be designed at a lower cost. Intel also said the tests also showed more than 30 percent improvement in platform voltage drop and 6 percent frequency benefit -- factors that will contribute to performance and power efficiency.
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It is the first in the industry to enable backside power on a test chip, which can drive the world into the next era of computing. PowerVia, which will be available on Intel's 20A manufacturing process node in the first half of 2024, is Intel's industry-leading backside power delivery solution. It addresses the growing interconnect bottleneck in area scaling by shifting power routing to the back side of the wafer.
Onsemi Is Still Facing Shortage Challenge
It has been revealed that despite the recent downward trend in demand, there may be an imminent shortage of notebook components like the NCP4 and NCP8 series. This is because the supply side is still trying to fulfill the backlog of orders from last year's high-demand period.
ST’s Lead Times Are Easing
The market demand for MCU series F0, F1, and F3 has decreased due to the relatively abundant supply in the market now and customers are looking for more cost-saving solutions. Lead times can be as fast as 8 weeks.
Demand for TI Is Decreasing
TI's overall demand fell significantly, and the market price of general products continues to be low. It is slowly beginning to return to normal levels.
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However, the supply shortage of MSPxxx series MCU and TMS320xxx series DSP still has not improved, and the prices have increased. The supply of MSP series and TMS320 series is still relatively tight, and the prices of PMIC series are still at a high level, while the supply shortage of TLV and TPS series is gradually easing.
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In addition, there are market rumors about TI will begin a comprehensive downward adjustment of chip prices in the Chinese market, which will be against the Chinese chip to reduce prices.
Microchip’s Overall Demand Is Weak
Microchip's overall demand is weak. Its main demand is concentrated in KSZ8999I, PIC32MX795F512, and ATXMEGA128 series. Because of the shortage, some prices of products are high.
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Microchip's overall lead time is gradually recovering. Due to the sufficient inventory, the price of general products went close to the normal level, such as MCP17XX, MCP25XX, and other interface chips.
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However, the popular ATMEL 8, 16-bit MCU capacity scheduling is unstable. Part of the ATXMEGAx will last 52 weeks. The lead times of popular product numbers are hard to return to normal level.
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Prices of Most Infineon’s Products Are Dropping
Infineon's prices for most products have come down, but some products are still in shortage with extremely high prices, such as some irreplaceable high-end automotive MCU Aurix TC series.
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As for functional devices, IGBT and high-voltage MOS continue to be in short supply. TLE series still has a long lead time of around 50 weeks, while other products are under pressure from inventory for demand is relatively sluggish.
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Infineon's revenue grew 25% year-on-year in the first quarter, with a strong 35% growth in the automotive products business compared to the same period last year.
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Demand for Broadcom Focuses in Automotive Field
Demand for Broadcom's consumer and communications products is sluggish, while shortages are concentrated in some automotive products and some high-end PLX products because of the rapid development of artificial intelligence.
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Broadcom signed a multi-billion dollar agreement with Apple in May to collaborate on the development of 5G RF components, including FBAR filters and tip other wireless connectivity components.
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