Flip Chip Market Forecast, 2024-2030

Flip Chip Market Overview:

Flip Chip Market size is estimated to reach $48.32 billion by 2030, growing at a CAGR of 7.5% during the forecast period 2024-2030. The electronic industry has increased the use of flip chips because of their multiple advantages, including cheaper cost, greater packing density, enhanced circuit reliability, and smaller dimensions. Consequently, the global increase in demand for smart electronics is likely to boost the growth of the global flip chip market. Additionally, by proving to be an appropriate solution for electrical interconnections, the flip chip has transformed the portable electronics and electric car sectors.

Some prominent manufacturers are increasing their investment in these technologies, broadening their coverage. For instance, in March 2021, Samsung Electronics collaborated with Marvell to create a revolutionary system-on-a-chip to improve 5G network performance. The newly released chip is used in Samsung's huge MIMO and is expected to be available to Tier One operators by Q2 2021. Similarly, in November 2020, Mediatek, Inc. agreed to pay roughly USD 85 million for Intel Enpirion's power management chip assets.

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Market Snapshot:?

Flip Chip Market - Report Coverage:

The “Flip Chip Market Report - Forecast (2024-2030)” by IndustryARC, covers an in-depth analysis of the following segments in the Flip Chip Market.

AttributeSegment

By Solder

• Copper
• Tin
• ?Tin-Lead
• Lead Free
• High Lead
• Gold
• ElectricallyConductive Epoxy Adhesives
• ?Eutectic
• Others

By Substrate

• Laminates
• Ceramics
• Polyamides
• ?Glass
• ?Silicon
• Others

By Bonding

• Adhesion Mechanism
• ?Metallurgical bonding
• Direct bonding
• ?Hydrogen bonding
• Mechanical interlocking
• Vitreous bonding

By Solder Technique

• Solder Bumping
• Stud Bumping
• Adhesive Bumping

By Packaging

• Flip Chip Ball Grid Array (FC BGA)
• Flip Chip-Pin Grid Array (FC PGA)
• Flip chip Land Grid Array (FC LGA)
• Flip Chip System in A Package (FC SiP)
• Flip Chip Chip Scale Package (FC CSP)
• Wafer Level Chip Scale Package (WLCSP)
• Flip Chip Quad Flat No Lead (FCQFN)

By Application

• Memory based
• RF, Analog, Mixed Signal and Power IC (2D IC, 2.5D IC, 3D IC)
• Sensors (IR Sensors, CMOS Image Sensors, Others)
• Light emitting diode
• ?Central processing unit
• Graphics processing unit
• System-on-a-chip
• Optical devices
• Micro electrical mechanical systems (MEMS) devices
• Surface acoustic wave (SAW) devices
• ??Others

By End User

• Consumer electronics
• Automotive
• ?Industrial equipment
• ?Healthcare
• ?Military & Defense
• ?Aerospace
• IT & Telecom
• ?Others

By Geography

• North America (U.S, Canada and Mexico)
• Europe (Germany, France, UK, Italy, Spain, Russia and Rest of Europe),
• Asia-Pacific (China, Japan, South Korea, India, Australia and Rest of Asia-Pacific),
• South America (Brazil, Argentina, and Rest of South America)
• Rest Of the World (Middle East and Africa).

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COVID-19 / Ukraine Crisis - Impact Analysis: ?

• The market for Flip Chip was hit by the COVID-19 pandemic. The pandemic has affected global supply chains, resulting in shortages of some materials and components used in flip chip manufacturing. This has resulted in production delays and higher expenditures. With several industries experiencing a decline as a result of Covid-19, demand for flip chip devices has decreased. As a result, firms in the industry have seen decreasing revenues and earnings.
• The conflict between Russia and Ukraine caused significant global instability and a wide range of issues in the world economy. Russia and Ukraine are both major semiconductor players, with multiple semiconductor production facilities situated in both nations. The war caused supply chain interruptions, particularly in transportation, logistics, and material procurement.

Key Takeaways:

• Dominance of Asia-Pacific
• Geographically, Asia-Pacific (Flip Chip Market) held the largest share with 72% of the overall market in 2023 and it is poised to dominate the market over the period 2024-2030. This is owing to the Asia Pacific flip chip market being highly competitive, with key players including Amkor Technology Inc., ASE Group, Powertech Technology Inc., STATS ChipPAC Ltd., and United Test and Assembly Center Ltd. These companies are focusing on developing new products and technologies to maintain their market position and gain a competitive edge.
• Laminates Segment holds the largest market share
• Based on Substrate, the Laminates Segment held the largest Flip Chip Market share in 2023 and it is estimated to grow with a CAGR of 7.8% during the forecast period 2024-2030. This is owing to the growing demand for advanced electronic devices with higher performance and smaller form factors. This includes smartphones, tablets, wearables, and other portable devices that require high-speed data transfer, low power consumption, and robust reliability.
• High growth in Automotive Sector
• Based on End User, the Automotive segment is estimated to grow with the fastest CAGR of 9.0% during the forecast period 2024-2030. This is owing to the increasing adoption of electric and autonomous vehicles as these vehicles require high-performance computing power and reliability. The rise in demand for flip chip technology in the automotive industry is expected to continue as the industry continues to innovate and adopt new technologies. In 2020, Tesla, Inc. announced a $1.4 billion investment in its Shanghai factory to increase the production of its electric vehicles. In the same year, General Motors (GM) revealed that it would invest $2.2 billion in its Detroit-Hamtramck assembly plant to produce a range of electric trucks and SUVs.
• Miniaturization of electronic devices is projected to fuel market growth
• With the increasing demand for smaller, lighter, and more powerful electronic devices, flip chip technology has become the preferred choice for chip packaging due to its compact size, high density, and improved electrical and thermal performance.
• Growth in IoT devices globally is anticipated to drive market growth
• The Internet of Things (IoT) has seen rapid growth in recent years, with an increasing number of connected devices entering the market. The compact size, high-density, and improved performance of flip chip technology make it an ideal solution for IoT devices that require small form factors and high reliability.
• Complex design and manufacturing processes hamper the market growth
• Flip chip packaging involves a complex process that requires precise alignment, soldering, and interconnection of a large number of microbumps. This complex process presents significant challenges to manufacturers, including yield losses and high capital expenditure requirements is one of the factors hampering the growth of the Flip Chip Market.

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Key Market Players:?

Product/Service launches, approvals, patents and events, acquisitions, partnerships and collaborations are key strategies adopted by players in the Flip Chip Market. The top 10 companies in the Flip Chip Market are:

1. Texas Instruments?
2. STMicroelectronics?
3. Intel Corporation?
4. Samsung Group?
5. Amkor Technology?
6. TDK Electronics Europe?
7. BM Corporation
8. Taiwan Semiconductor Manufacturing Company?
9. 3M Company?
10. Kyocera International?

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