Flex Power Modules Unveiled Advanced AI-Optimized Power Solutions at embedded world 2025
Patrick Hopper
Publisher, President #Influencer @ OpenSystems Media | Embedded | AI | IoT | Military | Aerospace | Embedded World Media Partner #ew25 #embeddedworld
At embedded world 2025, Flex Power Modules presented its latest power modules developed to enhance AI-driven workloads while increasing power density in small form factors enhancing?energy efficiency?and space optimization. Flex Power Modules showcased its BMR352 and BMR316 solutions, both compatible with the Flex Power Designer software, supporting real-time configuration, simulation, and performance monitoring. Read more.
embedded world 2025: APLEX Highlighted AI-Driven Edge Computing and Industrial HMIs
APLEX Technology Inc. recently showcased its latest innovations in smart manufacturing, AI solutions, and certified industrial applications during embedded world 2025. The booth focused on APLEX’s extended lineup of industrial automation environments from factory automation HMI to application-oriented panel PC. Read more.
SYSGO Enhances Functional Safety and Performance with Intel's 13th Gen Core Processors
SYSGO - Embedding Innovations announced its support of Intel’s 13th Gen Intel Core processor family (formerly named Raptor Lake) functional safety-capable SoCs (System on a Chip) with its PikeOS RTOS and Hypervisor. SYSGO’s PikeOS is recognized for its security certifications promoted within various industries. Continue reading.
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