Fake Components, No Way!

People who care a lot about quality appreciate what we do. They like our products and trust us because we value honesty.

We know many components are sold from China to other countries, and foreign companies think their local suppliers get chips from China. Working with reliable partners helps them get the necessary components, save money, and buy smaller quantities. This way of getting chips is crucial. It makes the buying process more diverse and helps with urgent problems.

In Shenzhen Huaqiangbei market, which people often call the 'open market,' there are many chip suppliers. It's hard for people outside China to know which ones are good, even if they come to China to meet the suppliers.

We spent a long time studying these suppliers, working with them on actual orders, and understanding what they are good at. Then, we provide the products to our clients. Doing this requires a professional team that knows about components, can tell real from fake, talks well with others, brings resources together, and negotiates well.

The main question for our clients in other countries is

how to avoid buying fake component?

The best way is to test the components with a third-party Test Lab. A few tests can show if the product is real or fake. Our clients who make big orders often ask for these tests, and they trust the results. They might ask us to send the components directly to their factories for smaller orders because we've never had problems working together. They trust us a lot.

The following tests are essential:

Visual Test

The visual test involves a thorough inspection of the physical appearance of the chip. Technicians use optical equipment to examine the chip's structure, components, and overall condition. This test helps identify any visible defects, irregularities, or damages that may affect the chip's performance.

X-Ray Test

The X-ray test utilizes X-ray imaging to inspect the internal structure of the chip. This non-destructive testing method allows a detailed examination of the chip's components, solder joints, and internal connections. It helps identify hidden defects, such as cracks, voids, or misalignments, that may not be visible through traditional inspection methods.

De-Cap Test

The de-cap (decapsulation) test involves the removal of the protective outer layer of the chip to expose its internal components. This destructive testing method is often used to inspect the chip's die and bonding wires. It provides insights into the chip's construction quality and helps identify any issues affecting its functionality.

Function Test

The function test evaluates the chip's performance by subjecting it to predefined operations or conditions. This test verifies whether the chip functions as intended, meeting the specified electrical and operational requirements. It assesses the chip's ability to process information, execute commands, and perform its designated tasks accurately.

Solderability Test

The solderability test assesses the quality of solder joints on the chip. It involves exposing the chip's soldered areas to specific conditions, such as heat or flux, to evaluate the solder's adhesion and integrity. This test ensures that the chip can be reliably and securely connected to other components during the assembly process, contributing to the overall reliability of the electronic device.

We maintain an open-minded approach to embrace more possibilities, aiming to benefit you. We adopt a cautious mindset to verify the authenticity because we take responsibility for ourselves and you.

As a team, we efficiently utilize resources and approach opportunities with sincerity. We understand that we may not seize every opportunity, but we cherish each one. We don't easily give up; as long as you persist, we remain steadfast by your side.

Let us talk!

Electronic components RFQ: [email protected]

OhYes Global

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