The factors of why 6L PCB board are widely used
A six-layer #pcb consists of six layers of conductive material. It consists of a four-layer PCB with two planes between two additional signal layers. A typical six-layer printed circuit board consists of two inner layers, two outer layers, and two inner layers, one for power and one for ground. This design improves EMI and provides better routing for both low-speed and high-speed signals. Two surface layers are good for low-speed signal transmission, while two inner layers are good for high-speed signal transmission.
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Proper stacking of 6-layer PCB board can improve its performance. Depending on the type of radio frequency equipment, it can effectively control electromagnetic interference and contain multiple isolation components. Any mistakes in the design will affect the performance of the PCB board. So how should we design to give full play to the performance of the PCB board?
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First of all, before designing, we need to analyze and solve the number of ground planes, power planes and signal planes that the PCB board may need. Adhesive layers are an important part of any laminate as they provide better shielding of the laminate and reduce the need for external shielding cans.
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If you want to plan a dense board with little wiring space, you can install four signal layers, one ground layer, and one power layer. In high-density circuit boards, wireless signals and analog signals are mixed together, and the signal layer/ground/power layer/ground/signal layer/ground layer separates the inner and outer signal layers. This layered design facilitates EMI mixing in the inner signal layer. Stacked designs are also ideal for RF equipment because the AC power and ground planes provide decoupling.
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If you want to build a printed circuit board with many sensitive circuits, choose this stack: signal/power/2 signal/ground/signal, which can well protect sensitive traces and is more suitable for high-frequency analog signals or high-speed digital signals. These signals will be separated from the lower speed signals on the outer layers. This shielding is done on the inner layers, which also allows signals to be routed at different frequencies or switching speeds.
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The ground/signal layer/power/ground/signal layer/ground stack can be placed on the circuit board close to the strong radiation source. This stack can effectively control electromagnetic interference and is also suitable for boards used in noisy environments.
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