Exploring Microporous Boards: The Nano Revolution in Insulation!

Today, let's dive into the fascinating world of microporous principles, a key factor behind the outstanding performance of nano-insulation.

Thermal Conductivity – The Game Changer

Thermal conductivity, represented by the symbol λ (Lambda), is the defining factor when it comes to material heat transfer capabilities. Lower λ values signify materials that are more resistant to heat transfer. In the pursuit of effective insulation, industries are continually seeking materials with low λ values, especially as insulation and fire resistance become increasingly critical.

Heat Transfer Basics

Every material transfers some heat under a temperature gradient across its thickness. According to thermodynamics, heat always flows from higher to lower temperature regions. The effectiveness of a material as a thermal insulator can be expressed in terms of its thermal conductivity (λ), where the rate of energy transfer through a body is directly proportional to the temperature gradient across the body and the cross-sectional area.

The fundamental law of heat transfer is expressed as:

Q =λ -（DT / DX）

Q represents heat transfer (W), multiplied by the cross-sectional area (square meters), DT DX is the temperature/thickness gradient (K/m), and λ is defined as the thermal conductivity (W/m·K).

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Microporous Insulation – What Sets it Apart

Microporous insulation, defined by ASTM GP3688, refers to a material with an average pore size in compressed powder or fiber form, where the interconnection of pores is below or equal to the average free standard atmospheric pressure air molecular path. It may include shading agents to reduce radiant heat transfer.

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Unlocking the Secrets of Low Thermal Conductivity in Nano Micro-Porous Insulation: Conduction, Convection, and Radiation:

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• Conduction: The spacing between silica particles is around 10 nanometers, minimizing direct contact and reducing heat conduction.

• ?Convection: The tiny gaps between silica particles are smaller than the minimum distance required for energy transfer between air molecules, minimizing heat convection.

• Radiation: Shading agents and infrared barrier agents reflect thermal radiation, minimizing radiation energy transfer.

• In conclusion, the result is a reliable product with extremely low thermal conductivity and λ values, approaching the theoretical minimum based on the laws of physics.

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Compared to traditional insulation materials, Firebird Microporous Board boasts the following advantages in nano-micro-porous insulation:

? Thinner profile for equivalent insulation effectiveness.

? Lower heat loss within the same installation space requirements.

? Greater available internal space for equipment under identical installation space and heat loss conditions.

Firebird Microporous Board can withstand temperatures as high as 1200°C/2192°F, making it suitable for a wide range of applications.

In addition to outstanding insulation performance, Firebird Microporous Board is easy to process, allowing the use of standard carpentry tools or equipment. It is easily cut, milled, and drilled, making it convenient for efficient insulation in complex installation environments.

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