Examples of high-frequency?PCB board selection??
Toptek PCB Co.,Ltd
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???????The following takes the high-frequency (microwave) PCB we designed and debugged as an example to illustrate the board selection.?
(1)?2.4GHz spread spectrum digital microwave relay plate selection
??Its structure includes 2M digital interface, 20M spread spectrum despreading, and 70M IF modulation and demodulation board. We use FR4 board, four-layer PCB board, large-area flooring, and use inductive chokes to isolate the high-frequency analog power supply from the digital part.The 2.4GHz RF transceiver uses F4 double-sided panels. The transceiver and receiver are shielded by metal boxes respectively, and the power input is filtered.??
(2)?1.9GHz radio frequency transceiver?Among them, the power amplifier uses PTFE board and double-sided PCB board; the radio frequency transceiver uses PTFE board and four-layer PCB board. They all adopt large-area flooring and functional module shielding isolation measures.???
(3) 140MHz IF transceiver?The top layer is made of 0.3mm S1139 plate, covering a large area, and the vias are isolated.?
(4) 70MHz IF transceiverUsing FR4 board, four-layer PCB board. A large area of floor is laid, and the functional module isolation belt is isolated by a series of vias.?
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(5) 30W power amplifier?Made of RO4350 board and double-sided PCB board. A large area of ground is laid, the spacing is constrained to be greater than or equal to 50-ohm line width, shielded with a metal box, and the power input is filtered.?
(6) 2000MHz microwave frequency source?????Made of 0.8mm thick S1139 sheet, double-sided PCB board.?????Conclusion: The devices in the wireless field on the current market involve a wide range of applications and are relatively complex. Especially in the current wireless communication market, competition is fierce. The price and time to market of products are increasingly becoming the focus of competition. Therefore, electronic engineers cannot simply consider technology when designing PCBs. Advancedness must be considered from many aspects, balancing key factors such as technological advancement, price advantage and shortening product time to market to improve product competitiveness.?