Exaddon Year in Review - 2023
As the year draws to a close, it is time to take stock and review a whirlwind 2023 for Exaddon.
Not only did we publish new research in key journals, expand our team, expand our customer base, and participate in groundbreaking joint research projects, but we also had the small matter of launching our new industrial application!
Join us on this retrospective look at the events and developments of the last year, starting with the biggest one of all!
Exaddon 3D Microprinting Enters the Semiconductor Probe Testing Arena
The biggest news of 2023 for Exaddon was the release of our new industrial application: Exaddon 3D Printed Probes . The 3D printing of probes for fine-pitch testing below <20 μm pitch is an unprecedented move, and one which seeks to address the pitch limit facing the semiconductor testing industry.
Exaddon travelled to the renowned SWTest Asia conference in Taiwan to present our new approach to an audience of probe testing experts, and was awarded the prize for “Best Data Presentation”. A stream of enquiries at the Exaddon booth reinforced the presentation plaudits, and was a great validation for the countless hours of research and hard work put into developing this application.
Since the conference in November, we have received many enquiries from major industry players, and the widespread media coverage following the announcement shows the significance of this novel approach.
To get the full story, please visit the dedicated website here.
Exaddon Research Published in Q1 Journals
Early 2023 saw Exaddon co-author important research with Empa on several topics, all of which were crucial in taking our technology to the next level and providing valuable data for our industrial application.
Direct 3D microprinting of highly conductive gold structures via localized electrodeposition.
This paper describes the 3D printing of gold microwires on prepatterned chips, followed by 4-point probe measurements to measure the conductivity of the gold wires. Results were excellent, and the research points toward a future of hybrid devices, wherein additive micromanufacturing is combined with existing micromanufacturing techniques.
Strengthening of 3D printed Cu micropillar in Cu-Ni core-shell structures.
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This paper revealed the amazing 3x strength increase brought about by coating copper microstructures with Ni shells just 250 nm thick.
The Cu micropillars were subject to various mechanical tests and simulations in order to analyze the material microstructure, and how the micropillars responded to mechanical stress.
Manipulation of Microsprings in a Desktop SEM
A collaboration with Swiss precision testing experts Imina Technologies SA and global scientific powerhouse 赛默飞世尔科技 resulted in fascinating images of the manipulation of microsprings 3D printed by Exaddon. The springs were 3D printed in copper and imaged using a Thermo Fisher desktop SEM whilst they were subject to precise mechanical manipulation by a robotic prober from Imina.
Exaddon Microscale AM Technology Overview
In 2021, we conducted an analysis of additive manufacturing (AM) companies operating at the microscale range.?This year, we conducted it again to see what developments had been made.
Exaddon Team Expands with New R&D Members
2023 also saw us extend our R&D department with the hiring of Dr. Francesco Colangelo and Matthieu Proffit , both of whom hit the ground running and jumped straight into major projects. As Exaddon’s customer base grows, and as we have moved into an industrial application, we are working harder than ever to further refine and improve our technology and processes.
Outlook 2024
Looking forward, 2024 is already set to be a very busy year for Exaddon, with shipments of our CERES print system to new customers, new papers for publication, multiple research collaborations, and of course the next steps in 3D printing probes for probe testing.
Be sure to follow all the news and developments on our LinkedIn page!