European Semiconductor Industry, SiC Modules, Automotive and Infrastructure, Power Conversion Lab, Grid and much more!
Maurizio Di Paolo Emilio
Content Editor & Technical Writer | Ph.D in Physics | Power Electronics, Renewable Energy, Embedded Systems, Quantum Computing
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The recent semiconductor supply crisis, originated by the pandemic and aggravated by hard-to-predict geopolitical tensions, has led countries on all continents to reconsider their manufacturing strategy. There is no doubt that semiconductors represent the engine of economic growth and help to ensure the wellness of citizens. The European Commission, in response to such concerns, has launched an ambitious plan, dubbed the Chips Act, to double Europe’s share of semiconductor production by 2030. Is this approach enough to overhaul the market and reverse the trend after years of systematic outsourcing policies?
The European Commission, with the Chips Act, will boost Europe’s technological sovereignty, competitiveness, and resilience and contribute to the digital and green transitions. The recent global chips shortage has disrupted supply chains, caused acute penury of products ranging from cars to medical equipment, and in some cases even forced factories to halt operations. Some of the industries involved say automotive and industrial, are strategic to Europe and excel in the world economic scenario. The European Chips Act Regulation was proposed as part of a broader package of measures for strengthening the EU’s semiconductor ecosystem proposed by the Commission in February 2022.
Double-Side Cooled SiC Modules For Improved Traction Inverter Performance
By Sonu Daryanani
A key goal of de-carbonization is the electrification of everything. To this end, electric vehicles (EVs) are transforming the personal and commercial transportation sector with estimates of EVs representing over 58% of all new car sales by the year 2040. The bottlenecks here lie in the lack of sufficient charging infrastructure (outside of the driver’s home), a limited driving range, and long charging times.
The Verticalization of the Automotive Industry
By Frank Heidemann
On a modern electric vehicle, semiconductors and power electronics have emerged as some of the most critical on-board components. Unlike with the combustion engine, these are not areas where carmakers have managed to ringfence ownership of expertise, and that is leading to a tremendous power struggle as global companies like 英伟达 , Bosch , 英飞凌 , 安森美半导体 and 意法半导体 have exerted their dominance.
Wine Down Friday with QPT Advisor Geoff Haynes
By Maurizio Di Paolo Emilio
Geoff Haynes, a distinguished pioneer in the realm of gallium nitride technology, has embarked on a new chapter by joining QPT as an advisor. With a remarkable journey that spans years of dedication to the development of GaN transistors and fast-switching power converters, his contributions have been invaluable. His aspirations for the future of GaN transistors extend beyond technological advancements, aiming to harness their potential for reducing global CO2 emissions. “Wine Down” this Friday with Geoff!
Smart Charging Infrastructure for Electric Vehicles
By Abhishek Jadhav
The growing use of electric vehicles has posed challenges for the electricity grid as it needs to meet the increased demand. This surge in electric vehicle adoption has brought about significant issues for power networks, such as higher power consumption, increased short-circuit currents, and the possibility of voltage fluctuations. This article outlines how a smart charging infrastructure can contribute to solving these challenges and supporting the electricity grid.
Versatility of Power Conversion in Rail Electronics is Key to Low Cost of Ownership
By Christian Jonglas
There are particular difficulties though in the expansion of rail systems: the industry is quite conservative and changes are slow and capital-intensive; payback times are long, way more than typical government terms. If rail were to reach out to the more remote communities, whose only transport option at the moment might be cars, likely, these services would likely always be subsidized by the busier main routes and subject to cutbacks due to short-term political expediency.
WBG Semiconductors for Next-Generation PV & ESS Solutions
By Sonu Daryanani
Wide-bandgap (WBG) semiconductors like silicon carbide (SiC) and gallium nitride (GaN) are enabling higher-efficiency and more compact power-conversion solutions for next-generation photovoltaics (PV) and energy storage systems (ESS). In this article, we will highlight examples of such offerings from Infineon Technologies and 东芝 .
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Pioneering Next-Gen Solutions: Automotive & Power-Conversion Lab Unveiled
By Maurizio Di Paolo Emilio
onsemi has marked a significant stride in the field of semiconductor solutions with the inauguration of its state-of-the-art application test lab in Piestany, Slovakia. This pioneering facility stands poised to revolutionize the landscape of system solutions for electric vehicles and energy infrastructure (EI) power-conversion systems. In an interview with Peter Gergely, applications manager at onsemi Slovakia, he noted the pivotal role of innovative technologies and advancements in power-conversion systems within our developmental scope.
Dopant Technology Limits Diffusion and Boosts Efficiency
By Maurizio Di Paolo Emilio
Dopant diffusion is proven to be the major obstacle to GAA. A single dopant atom diffusing into the GAA channel can drastically alter the transistor properties, limiting voltage scaling in graphics processing units, central processing units, dynamic random-access memories (DRAMs) and virtually all other processors as chip sizes continue to decrease.
In this article, Robert Mears, CTO and founder of Atomera, will explain how advanced materials are poised to future-proof chip designs to keep pace with the increase in AI-based workloads.
Oxford Instruments Receives Significant Orders for GaN HEMT ALE and ALD Systems
By Maurizio Di Paolo Emilio
Several market-leading Japanese foundries have placed significant orders with Oxford Instruments Plasma Technology for plasma atomic layer deposition (ALD) and atomic layer etch (ALE) for the fabrication of GaN HEMT devices. The systems will provide support for the rapidly expanding GaN power electronics and radio frequency sectors. For power electronics, the systems will prioritize 5G/6G communication applications, while for radio frequency, they will concentrate on consumer fast-charging and datacenter applications.
Intel’s Technology Contributes to a More Resilient Grid Power Solution
By Maurizio Di Paolo Emilio
Intel disclosed that its technology is assisting in the operation of the new energy grid modernization solution developed by the Edge for Smart Secondary Substations (E4S) Alliance. The E4S solution facilitates the transition from a closed-hardware, proprietary architecture to a software-defined energy system that is flexible, open-ended, and disruptive to the existing system. Over seventeen million secondary substations facilitate the conversion of medium-to-low-voltage power in Europe. This solution is crucial for maximizing the potential of renewable energy resources as it employs secure, modular, silicon-enhanced technology to digitalize the subsequent generation of secondary substations.
LEM Unveils 800V Current Sensor for 3-Phase Traction Inverter Power Modules
By Maurizio Di Paolo Emilio
LEM unveils the HAH3DR S07/SP42, a new compact current sensor that is specifically engineered for 800V three-phase power modules.
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