The Era of Semiconductor "Great Cleaning"---Importance of cleaning process

With the development of large-scale integrated circuits, the importance of wafer cleaning becomes more and more prominent, and the requirement of precision is also higher and higher. When the process node is 35nm, the parameter requirements are already very high, and the particle density and COP on the surface of the silicon wafer should be less than 0.1/cm2. At present, the advanced process node is below 5nm, which requires higher wafer cleaning parameters.

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In all links of wafer processing, the cleaning process is essential. It is mainly used to remove the ultra-fine particle pollution, metal residues, organic residues, mask?reticles and photoresist residues left in the upper layer of wafer processing. It can also wet etch silicon oxide film, silicon nitride film and other materials or metals according to needs, so that the surface conditions of the wafer are ready for the next process.

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According to different media, semiconductor cleaning technologies are mainly divided into dry cleaning and megasonic cleaning. At present, megasonic cleaning is the mainstream, accounting for more than 90% of the total cleaning steps. According to different process requirements, megasonic cleaning uses specific chemical liquid and deionized water to clean the wafer surface without damage, in order to remove impurities in the wafer manufacturing process, usually with ultrasonic, heating, vacuum and other technical means. Dry cleaning refers to a cleaning technology that does not use chemical solvents and can be cleaned with relatively single pollutants.

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China has a vast semiconductor market, and cleaning equipment has a good development prospect. Megasonic cleaning equipment includes automatic trough cleaning equipment, high-frequency Megasonic cleaning machine, Megasonic cleaning nozzle, etc. Will provide refined cleaning technology, effective application in your industry.