EPIC Online Technology Meeting on Photonics Packaging and Testing

Ana González, EPIC Technology Leader on PIC Manufacturing, organized and successfully chaired with Jose Pozo the EPIC Online Technology Meeting on Photonics Packaging and Testing. Selected speakers, fully covering the supply-chain, discussed the packaging and testing of optical modules, passive/active optical alignment, wafer/die level packaging and testing as well the capabilities of the PIXAPP Pilot Line. Here below a short summary of these awesome presentations (the full event is available on YouTube ).

Peter O'Brien, Director of PIXAPP Pilot Line , spoke on the future of the EU funded PIXAPP pilot line, which aims to give an easy-access route for companies wanting to move from R&D to assembly and packaging of photonics technologies and thereby exploit the breakthrough advantages of PIC technologies.

Rocío Ba?os López, Test Manager at VLC Photonics, presented VLC’s engineering services for characterizing at bare die level and for packaging testing and their future capabilities for wafer level testing for optical and electrical measurements.

Torsten Vahrenkamp, CEO at ficonTEC, presented their machines for automated micro-assembly and testing of photonics systems and devices e.g., for laser soldering processes, epoxy attached processes of laser chips and the reactive attachment and alignment of fibre arrays and fibre-attached processes.

Tobias Gnausch, Product Manager Test & Measurement, Jenoptik Optical Systems, presented their ground-breaking ‘UFO probe’ an ultra-fast opto-electronics pool card solution for high volume testing of PICs at wafer level.

Tobias Müller, CTO at Aixemtec, presented their machines for precision assembly and testing of e.g., PICs, imaging systems and LIDAR systems for automotive applications to enable customers to launch new or automate existing production rapidly and with minimal technical and financial risk.

Hermann Moos, Product Manager at Finetech, spoke on their production of advanced submicron bonding systems for photonics packaging and advanced systems for high end applications, such as mini LEDs.

Georg Hegewald, Sales Manager at First Sensor, spoke on their expertise in building and packaging imaging sensors in high volumes using wafer dicing, die bonding, dye placement and wire bonding.

Pim Kat, Founder & CTO at Technobis, presented their production, packaging and test facilities for prototyping and small series production for universities and start-up companies e.g., for fibre array alignment, wire bonding, die bonding, oven curing and thermal management.

Mikko Karppinen, Research Team Leader at VTT, presented their variety of photonics integration and packaging technologies, including fibre-optic module packaging, high precision photonics assembly, ceramic packaging substrates, polymer photonics and printed electronics with hybrid over-moulding.

Scott Jordan, Head of Photonics at Physik Instrumente (PI), presented their unique parallel alignment technology that allows very fast alignments across multiple elements, channels, and degrees of freedom to be done in one step.