EOPCB chip

The introduction of the optical waveguide layer into the traditional printed circuit board constitutes the preparation process of the optical transmission layer in the optoelectronic printed circuit board EOPCB. The preparation process of the optical transmission layer is compatible with the traditional PCB manufacturing process. Material) is a low-refractive-index material selected from PMMA and COC materials that can withstand high temperature of 180 °C and pressure of 15kPa. It must meet certain performance indicators, including low light loss, small birefringence, and refractive index. High-performance waveguides can be formed only with high control, high thermal and humidity stability, good dimensional stability, and good adhesion properties. Among them, the optical loss at the working wavelength is the most important factor, which limits the size and size of the optical waveguide structure. The choice of design method. Generally speaking, the realization of optical interconnection requires the following parts: digital circuit, analog driving circuit, optical transceiver, passive optical path (optical fiber, free space, optical waveguide).

The success of EOPCB technology is largely due to the invention and application of Vertical Cavity Surface Emitting Laser (VCSEL). The functional module provides an interface with the EOPCB through an optical transceiver module. The optical transmitting module adopts a VCSEL array, and the optical receiving module adopts a PIN array. .The receiving control chip and the transmitting control chip are the auxiliary control driving circuits of the receiving module and the transmitting module respectively.

The optical interconnection layer adopts a multi-mode optical waveguide, and the end face of the optical waveguide and the optical transceiver (VCSEL/PIN) interface is at a 45° angle. Coating a layer of reflective film on the 45° end face can guide the optical signal in the waveguide. The application of EOPCB technology is attractive, but before its large-scale practicality, problems such as waveguide materials, design tools, inexpensive optical modules, and coupling between waveguides and devices must be addressed. and standardization issues.

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