DuPont? Kalrez? Perfluoroelastomer Parts-In Semiconductor Industry – Plasma Processes

DuPont? Kalrez? perfluoroelastomer parts have been used successfully in highly aggressive sealing environments for more than 40

years. Kalrez? parts have excellent chemical and thermal stability and have been specially formulated and processed to meet the unique

requirements of wafer processing environments. DuPont Kalrez? seals are available in standard and custom sized O-rings, as well as

customized shapes that meet the demanding requirements of wafer processing in plasma environments. A proprietary ultraclean process

and cleanroom handling is standard for all Kalrez? products utilized in the Semiconductor Industry.

Product Selector for Plasma Processes

The following table provides a quick and easy tool for the selection of Kalrez? parts depending on the production process type:

Current Kalrez? Product Offerings for Plasma Application

Kalrez? 9600

Kalrez? 9600 parts are designed for high purity, high temperature vacuum applications where seals are exposed to damaging Fluorine and Oxygen plasma radicals. It has an extremely low erosion rate and weight loss from plasma attack and provides excellent chemical resistance to Ammonia, Ozone, and Water Vapor. Its outstanding resilience in compression and ultra-low outgassing at high temperature conditions makes it especially suitable for applications where purity is paramount, such as Plasma-Enhanced Atomic Layer Deposition and Chemical Vapor Deposition processes.

Kalrez? 9500

Kalrez? 9500 parts are targeted specifically for deposition processes where ozone, ammonia and water vapor are used for processing, e.g. SACVD, FCVD, PECVD curing processes, etc. It has been specifically designed for use in applications where the plasma environment is more “chemical”, i.e., where oxygen and fluorine radicals are more dominant. Kalrez? 9500 also offers outstanding thermal stability, very low outgassing and excellent mechanical strength and is well suited for both static and dynamic sealing applications.

Kalrez? 9300

Kalrez? 9300 parts are designed for Dielectric (Oxide) Etch applications. It has been specifically designed for use in applications where the plasma environment is a combination of ions (“physical”) and radicals (“chemical”), i.e., where a balance of “physical” and “chemical” plasma erosion resistance is typically required. Kalrez? 9300 exhibits excellent resistance to oxygen and fluorine-based plasma and etch process chemistry. It also offers very low metals content, excellent thermal stability and mechanical strength, and is well suited for both static and dynamic sealing applications.

Kalrez? 9100

Kalrez? 9100 parts are targeted specifically for PECVD, ALD, HDPCVD and Conductor (Poly/Metal) Etch applications. Kalrez? 9100 has been specifically designed for low erosion and ultra-low particle generation in harsh plasma environments. It offers excellent thermal stability, very low outgassing as well as excellent elastic recovery and good mechanical strength properties and is well suited for both static and “select” dynamic sealing applications.

Kalrez? 8002

Kalrez? 8002 parts are a clear product for ash/strip applications. This unfilled product offers excellent plasma-cracking resistance and ultra-low particle generation in oxygen and fluorine-based plasmas versus mineral-filled products. Kalrez? 8002 exhibits excellent resistance to dry process chemistry, has good mechanical strength and is well suited for static, low stress/low sealing force and “select” bonded door seal applications.

Kalrez? 8705

Kalrez? 8705 perfluoroelastomer parts are primarily designed for seal locations in the direct path of high energy ultraviolet (UV) radiation emitted from a conventional light source or from plasma. They also provide excellent resistance to high concentrations of damaging oxygen free radicals, and outstanding sealing functionality in high temperature vacuum applications. Their extremely low sticking force makes them ideal for sealing quartz surfaces like quartz windows in UV cure chambers and quartz tubes in photoresist strip equipment, without leaving undesirable residues.