DRAM chip raise up in Q4

Detailed explanation of DDR3 and DDR4 memory technology

DDR3 and DDR4 are important technical standards for computer memory, released in 2007 and 2014 respectively. There are significant differences between the two in terms of architecture, speed, power consumption, capacity, etc., and they are suitable for different computing scenarios and needs.

1. Overview of DDR3 memory technology

1. Technical background

DDR3 (Double Data Rate 3rd Generation) memory is the third generation of memory technology after DDR2 and is widely used in personal computers, servers and embedded systems. The operating voltage of DDR3 memory is 1.5V, which significantly reduces power consumption compared to the 1.8V of DDR2 memory.

2. Performance characteristics

Frequency and bandwidth: DDR3 memory has a frequency range from 800 MHz to 2133 MHz and a data transfer rate of up to 17 GB/s, making it suitable for multitasking and applications requiring high memory bandwidth.

Timing and Latency: Timing (CAS Latency) is usually 9 to 15. Although the latency is higher, the bandwidth improvement of DDR3 makes up for this shortcoming.

Power consumption: Since the voltage is reduced to 1.5V, the power consumption of DDR3 is significantly reduced compared to DDR2. Especially in large-scale data center applications, reducing power consumption has become an important consideration.

3. Application scenarios

DDR3 is widely used in desktop computers, laptops and some low-end servers. Although it will be gradually replaced by DDR4 in 2024, it is still widely used in some fields that do not require high performance.

2. Detailed explanation of DDR4 memory technology

1. Technical background

DDR4 (Double Data Rate 4th Generation) is the successor of DDR3. Its technical specifications were released by JEDEC in 2012 and became popular in 2014. DDR4 is designed to increase data transfer rates, reduce power consumption, and increase the density and reliability of memory modules.

2. Performance characteristics

Frequency and bandwidth: The frequency range of DDR4 memory is from 1600 MHz to 4800 MHz, and the data transfer rate can reach up to 38.4 GB/s, which is a significant improvement over DDR3. This makes DDR4 ideal for high-performance computing, data analysis, virtualization and other applications that require high bandwidth.

Timing and delay: Although the timing of DDR4 is generally between 15 and 19, its higher frequency and bandwidth can effectively compensate for this delay, making it perform better in practical applications.

Power consumption: The operating voltage of DDR4 is further reduced to 1.2V, saving more power than DDR3, which is particularly important in data centers and large-scale server applications.

Capacity: The capacity of a single DDR4 memory stick ranges from 4GB to 128GB, far exceeding the upper limit of DDR3, making it excellent in high-end servers and workstations that require large amounts of memory.

3. Application scenarios

DDR4 is widely used in modern computer systems, including high-end PCs, servers, data centers and enterprise-level applications. Its high performance, high capacity and low power consumption make it an essential part of modern computing needs.

3. Technical comparison between DDR3 and DDR4

1. Frequency and bandwidth

The frequency and bandwidth of DDR4 are significantly higher than DDR3. For example, DDR4 has a bandwidth from 12.8 GB/s to 38.4 GB/s, while DDR3 has a bandwidth from 6.4 GB/s to 17 GB/s. The frequency range of DDR4 has also been greatly expanded, providing higher data transmission capabilities.

2. Power consumption

The operating voltage of DDR4 is 1.2V, which is lower than the 1.5V of DDR3, further reducing power consumption, which is particularly important in high-density servers and data centers.

3. Timing and delay

Although DDR4's timing is generally higher than DDR3, its higher frequency makes up for the latency issue, making DDR4 excellent in practical applications.

4. Capacity

The upper limit of a single memory capacity of DDR4 reaches 128GB, while the upper limit of DDR3 is 16GB. As the amount of data increases, the high-capacity advantages of DDR4 become particularly obvious.

5. Application environment

DDR3 is mainly used in low- and mid-range computing devices, while DDR4 is widely used in high-end PCs, workstations, and servers.

4. HOREXS, a DRAM packaging substrate manufacturer with more than 15 years of experience

As an experienced semiconductor packaging substrate manufacturer, HOREXS has long been focused on the mass production of DDR3 and DDR4 memory packaging substrates. The company's advanced processes, such as Tenting, RCC and mSAP, ensure the high quality and high performance of the packaging substrate, which can meet the stringent reliability and performance requirements of modern memory modules.

1. Highly reliable manufacturing process

HOREXS's manufacturing process has high precision and reliability, especially in the production of DDR4 packaging substrates, ensuring the stable operation of memory modules at high frequencies and high bandwidths.

2. Green production and traceability

HOREXS's factory adopts green production technology and meets environmental protection requirements. At the same time, using MES and ERP systems, HOREXS can achieve full-process traceability of products and provide customers with higher quality assurance.

3. Market impact

As a global partner of OSAT, Fabless, IP, etc., HOREXS occupies an important position in the memory packaging substrate market. Especially in the application of DDR3/DDR4 products in mainland China, the high-performance packaging substrates provided by HOREXS provide important support for the market.

5. DDR3 and DDR4 market outlook in the fourth quarter of 2024

1. Sustainability of DDR3 market demand

Although DDR3 technology is relatively mature and is gradually being replaced by DDR4, there is still a certain market demand for DDR3 in the fourth quarter of 2024. Especially in cost-sensitive fields such as embedded systems and industrial control equipment, DDR3's cost-effective advantage makes it still highly competitive. However, as more devices transition to DDR4, DDR3's market share is expected to shrink further.

2. Dominance of the DDR4 market

DDR4 will continue to dominate the memory market in 2024, especially in fields such as high-performance computing, artificial intelligence, and big data processing. As computing demands continue to increase, the advantages of high frequency, high bandwidth and large capacity of DDR4 memory will be more widely used. In the fourth quarter of 2024, the demand for DDR4 is expected to maintain steady growth, while prices may fluctuate due to supply chain and production costs.

3. Impact of new technologies on the market

As DDR5 memory gradually enters the market, the status of DDR4 may be challenged. However, considering the wide application of DDR4 in the existing market and the cost and compatibility issues that DDR5 may face during the popularization process, DDR4 will still maintain strong demand in the fourth quarter of 2024. For manufacturers, how to balance production resources between DDR4 and DDR5 will become the key to market competition.

6. Summary

There are significant differences between DDR3 and DDR4 memory in terms of performance, power consumption, capacity, etc., and each is suitable for different application scenarios. In the fourth quarter of 2024, although the market demand for DDR3 will gradually decrease, it will still have a place in some specific areas. DDR4 continues to dominate the market with its excellent performance and wide range of applications.

As a leading DDR3 and DDR4 packaging substrate manufacturer, HOREXS provides the market with highly reliable memory packaging substrate products through advanced production processes and strict quality control. Looking to the future, as the market demand for high-performance memory increases, HOREXS will continue to play an important role in the DDR4 and future DDR5 and DDR6 markets.