Do you know how to do the selective soldering ?

Selective soldering is one of the processes used when manufacturing various electronic components (usually circuit boards). Typically, this process involves soldering specific electronic components to a printed circuit board without affecting other areas of the board. This differs from various reflow soldering processes which expose the entire board to molten solder. In fact, selective soldering can refer to any soldering method, from hand soldering to dedicated soldering equipment, as long as the method is precise enough to use solder only in the desired areas. Selective soldering usually involves circuit boards. It is common for circuit boards to go through several different soldering processes during the manufacturing process. For example, a circuit board may have all the less sensitive components, such as resistors, mounted and soldered using an oven reflow process. The board will then be selectively soldered to allow its more sensitive components to be mounted under different or more controlled conditions, such as within a very specific temperature range. A circuit board may have all its less sensitive components, such as resistors, soldered using an oven reflow process after installation. There are several different techniques that can be used to perform selective soldering tasks. These techniques can solder the required connections all at once, or one at a time. Typically, one-shot welding technology requires specialized tooling for each set of tasks it has to perform. While such tools usually don't require one-on-one techniques, they tend to take longer to complete a given task. Mass selective dipping can solder multiple connections at the same time. This method requires the manufacture of a specialized tool that can only be used to solder a set of connections on a specific board design. The tool for this method has many small holes through which molten solder is pumped, creating a series of small puddles. Then place the board on the tooling so that it dips the desired area of the board into the solder pit. Another one-shot technique is the selective pore size method. This technique typically uses a special tool to shield all parts of the board except where solder is required. In these locations, the tool has an opening or hole. circuit boards, attach the tools together, then dip in molten solder that only reaches the areas where the tools are exposed. Microwave systems for selective soldering are one of the cheapest methods. This technique uses the equivalent of a very small bubble of molten solder. Solder connections are required to move the board past the bubble and place it on it. While the technique does not require special tools, moving the board repeatedly, one connection at a time, is a very slow process. Laser welding systems are the fastest and most precise of the disposable type technologies. Using this method, a computer program can quickly position a laser to heat each solder joint individually. This is a very precise method that requires no special tools; however, it is still significantly slower than all throwaway systems

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