Discussion of SiP packaging substrates

Discussion of SiP packaging substrates

System in Package (SiP) is an advanced packaging technology that integrates multiple chips with different functions in one package to achieve high-density integration and multi-functional applications. SiP technology is becoming more and more common in modern electronic devices, especially in mobile communications, Internet of Things (IoT), wearable devices, automotive electronics and other fields. This article will explore in depth the SiP packaging substrate, SiP packaging chips and their applications, and pay special attention to the key elements and technical difficulties of SiP packaging substrate manufacturing, as well as how to reduce costs and ensure quality through advanced technology and supply chain management.

SiP packaging substrate

Overview of SiP packaging substrate

SiP packaging substrate is one of the cores of SiP technology, carrying and interconnecting chips, passive components and other electronic components with different functions. Unlike traditional single-chip packages (such as BGA, QFP), SiP substrates must meet higher interconnection density, more complex electrical performance and more stringent thermal management requirements. Therefore, the manufacturing of SiP packaging substrates involves multiple complex processes and technologies.

Manufacturing elements of SiP packaging substrates

Material selection: The material selection of SiP packaging substrates is crucial. Common materials include FR4 (glass fiber epoxy resin), BT (benzoxazine), ABF (modified epoxy resin), etc. Different materials have different dielectric constants, thermal expansion coefficients and mechanical strengths, and must be selected according to specific application requirements.

Layer design: SiP package substrates usually adopt a multi-layer design to achieve high-density wiring and multi-functional integration. The increase in the number of layers can increase the wiring density, but it also increases the difficulty and cost of manufacturing. A typical SiP substrate may contain 4 to 20 layers.

Wiring density: High-density interconnect (HDI) technology is widely used in SiP substrates, and high-density wiring is achieved through microvia, blind vias and buried vias. The increase in wiring density can significantly improve the performance of the package substrate, but it also puts higher requirements on the manufacturing process.

Thermal management: Since SiP packaging integrates multiple chips, thermal management is a key issue. An effective heat dissipation path must be designed, including the use of high thermal conductivity materials, the addition of heat dissipation layers, and the optimization of heat dissipation structures to ensure the reliable operation of the chip.

Signal integrity and power integrity: SiP package substrates need to consider signal integrity (SI) and power integrity (PI) issues. By optimizing wiring design, using power planes and ground planes, and adding decoupling capacitors, signal transmission quality and power stability can be improved.

Technical difficulty of SiP package substrate manufacturing

Precision machining: The manufacturing of SiP package substrates requires highly precise machining processes, especially in HDI technology applications. The drilling, metallization and filling processes of fine through holes require extremely high precision and consistency.

Multi-layer alignment: The inter-layer alignment accuracy of multi-layer substrates has an important impact on the performance of the final product. Alignment errors can cause problems such as signal transmission delay, reflection and crosstalk, so high-precision alignment and stacking processes are required.

Material compatibility: Different materials have different thermal expansion coefficients and mechanical properties. During the manufacturing process, it is necessary to ensure the compatibility between materials to prevent deformation, cracking and delamination of the substrate.

Thermal management design: Complex thermal management design requires accurate implementation during the substrate manufacturing process, including the layout of heat dissipation channels and the application of high thermal conductivity materials.

Cost control: SiP package substrate manufacturing costs are high, and costs need to be controlled through process optimization, material selection and large-scale production to meet market demand.

SiP packaged chips

Features of SiP packaged chips

SiP packaged chips achieve system-level functions by integrating multiple chips with different functions in one package. These chips can include processors, memory, RF chips, power management chips and various sensors. The main features of SiP packaged chips are as follows:

High integration: Integrate multiple chips and passive components in one package to achieve system-level functions, reducing the size and weight of the system.

High performance: Improve system performance by optimizing the interconnection and signal transmission between chips to meet the needs of high-speed data transmission and complex computing.

Flexibility: Ability to flexibly configure chip combinations according to different application requirements to achieve customized functions.

Reliability: Improve system reliability and life by optimizing packaging structure and thermal management design.

Application of SiP packaged chips

SiP packaged chips are widely used in the following fields:

Mobile communications: In mobile devices such as smartphones and tablets, SiP packaged chips integrate key components such as RF chips, processors and memories to achieve high performance and miniaturization.

Internet of Things (IoT): In IoT devices, SiP packaged chips integrate sensors, communication modules and processors to achieve low power consumption and high efficiency.

Wearable devices: In wearable devices such as smart watches and fitness trackers, SiP packaged chips integrate multiple functions to achieve miniaturization and high integration.

Automotive electronics: In automotive electronic systems, SiP packaged chips integrate sensors, controllers and communication modules to achieve intelligence and high reliability.

Medical electronics: In medical devices, SiP packaged chips integrate biosensors, processors and communication modules to achieve high precision and high reliability.

Solutions for SiP packaged substrate manufacturing: HOREXS

HOREXS, as a professional electronic packaged substrate supplier, is committed to helping customers reduce the procurement cost of packaged substrates and ensure product quality through advanced technology and high-quality services. The following are HOREXS's advantages and solutions in SiP packaged substrate manufacturing:

Advanced process technology: HOREXS uses advanced HDI manufacturing technology and high-precision processing equipment to achieve high-density wiring and multi-layer alignment, ensuring high performance and high reliability of the substrate.

High-quality material selection: HOREXS cooperates with the world's leading material suppliers to select high-quality substrate materials to ensure the electrical performance and thermal management capabilities of the products, while reducing costs through bulk procurement.

Strict quality control: HOREXS implements a strict quality control system, and strictly tests every link from raw material procurement to production and processing to ensure product consistency and reliability.

Customized solutions: HOREXS can provide customized substrate design and manufacturing services according to the specific needs of customers to meet the special requirements of different application scenarios.

Supply chain management: HOREXS optimizes supply chain management, shortens production cycles, improves production efficiency, and reduces customers' procurement costs.

Technical support and service: HOREXS has an experienced technical team that can provide customers with comprehensive technical support and after-sales service to solve problems encountered by customers in substrate design and use.

Summary

As the core of SiP technology, SiP packaging substrates involve complex manufacturing processes and technical requirements. High-performance SiP packaging substrates can be manufactured by selecting suitable materials, optimizing layer design, increasing wiring density, effectively managing heat, and ensuring signal integrity. With its advanced process technology, high-quality material selection, strict quality control, customized solutions and efficient supply chain management, HOREXS can help customers reduce the procurement cost of packaging substrates and ensure product quality. Through cooperation with HOREXS, customers can obtain high-performance and high-reliability SiP packaging substrates to meet various application requirements and enhance market competitiveness.