Beat the Heat with EMI and Thermal Management Solutions

The size of electronics is getting smaller every day. As a manufacturer of components, we are influencing this trend, and as a service-oriented company, we also understand the potential challenges of incredibly compact designs. A big example of this is when a customer fails EMC testing. Electrical insulation is another challenge for power electronics. When compact devices have a high-power density, two phenomena – electromagnetic interaction between closely spaced components and heat accumulation – are frequently seen. Electromagnetic shielding and thermal paste are used when a clever layout simply isn’t enough.

So we asked the question- "Is it possible to solve multiple problems at once?" WE can certainly try! As a result, we developed easy-to-process, thermally conductive materials that can do more.

• The WE-TGF (Thermal Gap Filler) is a self-adhesive filler pad that provides an electrically non-conductive barrier with excellent dielectric strength. The pad’s thermal conductivity ranges from 1 W/(m*K) to 6 W/(m*K) and is available in thicknesses between 3 and 18 mm. The material adjusts to the various components heights on a board and fills the gaps between hot electronic components and metal housings or cooling assemblies. The pads’ secret is that they are made of silicone and ceramic particles.
• We are especially proud of the WE-FAS thermal absorber foil! It’s an innovative material with high thermal conductivity that can also be used as an electromagnetic interference absorber. It can absorb wide frequencies between 1 MHz and 3 GHz. It is ideal as a thermal interface material between a component and a cooling device due to its thermal conductivity of 1.4 W/(m*K).?

Both self-adhesive products are simple solutions for thermal management. You can learn more in our Application Note on the subject. Click here to access Flexible Absorber Sheets?and the?Design Guideline?with information on thermal interface materials.