Deploy AI For Smart Retail With MiTAC MA1

Deploy AI For Smart Retail With MiTAC MA1

AI has made its mark on just about every aspect of our lives, from professional to consumer, from medical care to autonomous vehicles. Retail applications are certainly no exception.

For example, when you couple AI with a vision system, you can significantly enhance the self-checkout processes by automating and streamlining several key tasks. The combination of AI and vision systems in self-checkout applications leads to accurate, efficient, and secure transactions, ultimately enhancing customer satisfaction while reducing operational costs for retailers. Read more.

Sondrel Introduces Advanced Modeling Process to Prove AI Chip Design


顺卓微电子(西安)有限公司 introduced an advanced modelling process for AI chip development with functional verification that runs through every phase of a chip’s development to verify the design is what was defined, and performance verification guaranteeing the chip works as desired. Paul Martin , Sondrel’s Global Field Engineering Director, comments “This new process enables us to analyze and balance the dataflow through the chip whilst executing the software workloads on the AI chip.” Learn more.

New Embedded Data Sheet - ADLINK Technology: OSM-IMX93

The OSM-IMX93 from ADLINK Technology is an OSM R1.1 Size-L module featuring NXP?? i.MX93 series processor with 2-core Arm Cortex-A55 & M33. With its in-SoC Arm Ethos U-65 microNPU, the module is made for edge solutions needing on-device AI processing at ultra-low power.

The OSM-IMX93 module supports LVDS and DSI graphics output, 2x GbE (1 TSN capable), 2x CAN bus, I2S audio codec interface, USB2 interfaces, and provides 15-year product availability.

Boasting the highest safety standards with a separate security island and available with rugged operating temperature options (-40°C to 85°C), the OSM-IMX93 is your ideal solution for various edge AI applications. Read more.

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