DDR6 new standard

According to JEDEC (Solid State Technology Association), DDR6 (including LPDDR6) has clearly replaced the SO-DIMM and DIMM memory standards that have been used for many years with CAMM2.

The minimum frequency of DDR6 memory is 8800MHz, which can be increased to 17.6GHz, and the theoretical maximum can be pushed to 21GHz, far exceeding DDR4 and DDR5 memory.

CAMM2 is a new memory standard that also supports DDR6 standard memory, which is suitable for large PC devices such as desktop PCs. JEDEC expects to complete the preliminary draft of the DDR6 memory standard within this year, and the official version 1.0 will not be available until the second quarter of next year at the earliest. Specific products may not be seen until the fourth quarter of next year or 2026.

From the perspective of LPDDR6, the memory product will adopt a new 24-bit wide channel design, with a memory bandwidth of up to 38.4GB/s, which is much higher than the existing LPDDR5 standard. The maximum rate of LPDDR6 can reach 14.4Gbps, and the minimum rate is 10.667Gbps, which is equivalent to the maximum rate of LPDDR5x and much higher than the 6.7Gbps of LPDDR5.

It is understood that the price of the real CAMM2 standard LPDDR6, taking the 32GB specification as an example, is about US$500, which is 5 times that of LPDDR5 (SO-DIMM/DIMM) memory.

From the perspective of market popularity, the industry believes that the standard adopted by DDR6 is the brand-new CAMM2, and production equipment must also be replaced on a large scale, which will bring a new cost structure. At the same time, the iteration of new standards in the stock market will also be limited by cost requirements, which limits the speed of large-scale popularization of DDR6 or LPDDR6.

At present, some memory products of upstream manufacturers such as Samsung, SK Hynix, and Micron already support the CAMM2 standard; among downstream system manufacturers, Lenovo, Dell, etc. are also following up. It is reported that Dell used CAMM2 memory boards in its enterprise-end product line in 2023.

HOREXS's successful experience in DDR4 and DDR5 package substrates

HOREXS has accumulated rich experience in the production of DDR4 and DDR5 package substrates, which has laid a solid foundation for meeting the challenges of DDR6.

Successful experience in DDR4 package substrates

In the production of DDR4 memory package substrates, HOREXS has successfully achieved high-quality and large-scale production by introducing advanced production equipment and optimizing manufacturing processes. HOREXS's DDR4 package substrates have won wide recognition in the market, and its products are widely used in servers, PCs, and high-performance computing.

Breakthrough in the production of DDR5 package substrates

With the launch of DDR5 memory, HOREXS has made further breakthroughs in the generation technology of package substrates. Through innovative material applications and process optimization, HOREXS has successfully achieved mass production of DDR5 package substrates. HOREXS's DDR5 package substrates have excellent performance and stability, and have been highly praised by customers.

Future Outlook

With the launch of the DDR6 memory standard, the memory market will usher in a new round of technological innovation and market opportunities. As a leading semiconductor packaging substrate manufacturer, HOREXS will continue to uphold the innovation-driven development concept and meet the manufacturing needs of DDR6 packaging substrates through technology improvement and market layout.

In the future, HOREXS will continue to increase R&D investment, continuously improve its technology level, and ensure its leading position in the DDR6 packaging substrate market. At the same time, HOREXS will also actively expand the global market and win more customers' trust and cooperation by providing high-quality products and services.

In short, with the launch of the new DDR6 memory standard, HOREXS will usher in new development opportunities and challenges. With its successful experience in the production of DDR4 and DDR5 packaging substrates, as well as its continuous efforts in technology and market, HOREXS is confident that it will achieve even more brilliant results in the DDR6 packaging substrate market.