DB291：DOCBOND low temperature curing glue for camera module CCD, CMOS bonding

Camera modules (CCM) are an important part of modern mobile phones, computers and other electronic devices. It consists of lens set, voice coil motor, filter, sensor, circuit board, FPC connector and other components. It is responsible for capturing light and converting it into electronic signals, and then converting them into digital signal output to form the image we see. In this process, the capture and transmission of the photoreceptor has a great impact on the quality of the presented image. Therefore, the sealing and fixing technology of CCD or CMOS is particularly important.

DOCBOND New Material's underfill glue DB291 is specially designed for CCD and CMOS sealing and bonding of camera modules. This glue can form good bonds between many different types of materials at lower temperatures and in a very short time. Its excellent working performance and high storage stability make it widely used in low-temperature curing processes. This kind of glue is mainly used to bond heat-sensitive components, such as memory cards, CCD/CMOS and other devices.

In addition to the above-mentioned sealing and bonding applications, DOCBOND New Material's underfill also plays an important role in other aspects of the camera module. For example, quick fixing of lens holder and lens holder after focusing, reinforcement of lens holder and PCB base material, bonding of filter lens and lens holder or lens holder, FPC reinforcement, etc. In these application scenarios, underfill ensures the stability of the camera module and the quality of image capture with its excellent performance and reliability.

In general, the application of DOCBOND New Material's underfill glue in camera modules not only enhances the stability of each component, but also improves the quality of captured images. This is critical to the performance of a camera, whether it's a mobile phone, computer or other electronic device, which requires precise light capture and reliable component mounting. DOCBOND New Material's underfill glue undoubtedly provides the best solution for the camera modules of these devices.