Controller heat returns sharply, industrial material hotspots emerge

In March, the heat of general-purpose MCU materials rebounded, indicating that the overall demand has improved, but its low price indicates that the current has not yet out of the de-stocking stage. Coupled with the continuous promotion of domestic substitution, the demand side of the demand for high-priced materials to reduce the degree of demand. The original factory delivery continues to improve, the market inventory increased, can well meet the current demand situation.

Industry dynamics, March 1, reported that the Indian government approved $ 15.2 billion chip manufacturing investment plan, including the Tata Group and UMC 12-inch project with Renesas joint venture packaging plant project. 4, reported that Sony big order TSMC Kumamoto plant to increase production of CIS; long electric technology announced the acquisition of Western Digital's flash packaging and testing enterprise Sheng disk semiconductor 80% stake. 5, the force of the power of electricity, said that it will be gradually withdraw from the panel driver IC and sensor foundry market; reports that Armor Man will increase the flash memory start rate to 90% to expand supply; Western Digital announced that it will be split, SSD and HDD business each operated independently; reports that Texas Instruments Gallium Nitride (GaN) production process is being transitioned from 6 inches to 8 inches. 12, ONC announced a structural reorganization, the establishment of Analog and Mixed Signal Division (AMG) Merger of the existing Advanced Solutions Group (ASG) and the Integrated Circuits Division (ICD), which is part of the Power Solutions Group; reports that Samsung has restored the capacity of its Xi'an flash memory plant to 70%. 12, Renesas confirmed that it will start postponing pay raises and layoffs. 13, reports that Samsung plans to raise flash memory prices downstream by 15%-20%; Samsung's HBM memory has been exposed as having a yield rate of only 20% at maximum; reports that Italy side asked STMicroelectronics to increase the amount of investment in Italy; Arm released its high-performance Neoverse-class chip design for automotive applications; on the 14th, Infineon sued Innocetech for patent infringement of GaN technology in the U.S. Court of California. 15, reports circulated that Huabang Electric on the success of the DDR3 memory price hike of 10%. 18, STMicroelectronics announced that it has cooperated with Samsung to launch a new 18-nanometer FD-SOI process, the first based on a new 18-nanometer FD-SOI process. SOI process, and the first MCU based on this technology is scheduled for mass production in 2025. Reports said TSMC or export CoWoS packaging technology to build a factory in Japan; reports said SK Hynix will restructure its China business, focus will be shifted to Wuxi. 19, SK Hynix announced the start of mass production of HBM3E memory; MediaTek announced the launch of the Dimensity Auto cockpit platform chip at the Nvidia GTC conference. 20, Micron said that this year's HBM production capacity has been sold out, and the vast majority of next year's capacity has also been booked. 21, Micron said that its HBM production capacity is already sold out. On the 21st, it was reported that Intel will invest $100 billion with the support of subsidies from the U.S. government to dramatically increase its chip production strength; NXP announced that it is working with NVIDIA to accelerate the application of machine learning to its edge processing portfolio.25 On the 25th, it was reported that the mature process foundry continued to cut prices by 4%-6% in the first quarter, and may cut them again in the second quarter; it was reported that Samsung will exclusively supply NVIDIA's 12-layer HBM3E memory; industry rumors that Samsung's 3-nanometer GAA process yields tripled to 30%-60%, but still lagging behind TSMC. 26, Dell has been exposed to layoffs to cope with the sharp decline in PC product shipments.

MCU hotness generally returns, but prices are not boosted

In March, the hot search TOP 10 is absolutely dominated by controller materials, the general return of STM32 materials shows that the overall demand has partially improved, and the transaction has become active again, but the price of the materials in the list has not been boosted, indicating that it is still in the stage of de-inventorying, and the influx of large-scale mainstream demand is still waiting for a long time. the large increase in the number of searches for STM8S materials indicates that the main demand recovery occurs in the basic application field, but its price still maintains the low level after a long period of decline. STM8S material searches increased greatly, indicating that the main demand recovery occurred in the basic application areas, but its price is still maintained after a long period of decline in the low level. March Microchip brand DSP material DSPIC30F2010-30I/SP heat greatly increased, the price also rose significantly, indicating that the influx of strong demand. In addition TI brand TMS320F28335PGFA heat compared to the early slump has rebounded, but its price did not boost, indicating that inventory pressure is still large. High-priced materials in the month have Xilinx's FPGA configuration storage unit XCF32PFSG48C, its search volume compared to the previous month has increased significantly, the price also has a certain increase, indicating strong demand.

Demand for industrial materials is concentrated, the acceptance of high-priced materials is low

In March, the inventory of materials to reduce the industrial category is dominated by sensors, power supply devices, switch controllers and other categories, comprehensive search volume and price changes, these materials are ushering in the rise in demand, which is mainly due to the post-holiday production of materials to start the preparation process and the concept of "new quality of productivity," and so on. Part of the previous period had a high degree of heat of the high-priced materials, the current situation of the demand side of the acceptance of high prices has been reduced, reflected in the substantial increase in inventory, representative of such as ON Semiconductor Manufacturing HART demodulator A5191HRTLG-XTP and so on. Other manifestations of inventory growth of general-purpose materials, at this time is also facing a weakening demand and de-stocking. In addition, the Murata LQH inductor materials earlier due to the heat of the production break, the current demand has been shown to decline, indicating that has gone through the peak of stocking.

IC demand and supply

In March, the market has recovered, and the significant increase in the search volume of STM32 materials shows that the overall demand has rebounded, but its price has not been significantly boosted after a long decline, which indicates that it is still in the de-stocking stage. The overall delivery period of other brands has been shortened, and the supply continues to improve; TI takes cost reduction and share expansion as the dominant direction, and the low price competition will continue; the delivery period of general-purpose materials of major brands such as ADI, NXP, Microchip, etc. has been shortened significantly, and the market has sufficient stock to cope with the current demand situation.

It is worth noting that domestic substitution in the MCU, power devices and other areas of progress on a wide scale, will again share away part of the share of the international manufacturers of materials, further impact on their demand, but also make it more difficult for demand-side acceptance of high-priced materials. On the other hand, with the accelerated development of intelligent industry and new energy vehicles, the deepening demand for various types of sensors and high-end power devices, favoring ON Semiconductor, Infineon and other original plants.

Memory, the price still depends on the original factory to control the tendency of supply, is expected to Q2 will continue to rise, but NAND flash memory and DRAM each different demand is expected to make the rise of each category of differentiation.