Computex 2024 & Robotics AI and Sensing with Texas Instruments
Embedded Computing Design
The leading source of in-depth tech knowledge, news, views, & instructional design content for the electronics engineer.
On this episode of Embedded Insiders, Senior Technology Editor, Kenneth Briodagh , and Errol Leon , System Engineering & Marketing Manager of Robotics at 德州仪器 (TI) discuss the work of robotics in collaboration with humans and the role of motor control, board-to-board communication and sensor fusion in the future of robotics.
But first, Richard Nass and Ken recap a recent trip to Taipei for Computex 2024. Tune in.
New Performance Boost: COM Express?? mini with 13th Generation Intel?? Core?? Technology
Explore ultra-compact embedded and edge computing with our in-depth whitepaper on COM Express?? mini, featuring the groundbreaking 13th Generation Intel?? Core?? Technology.
This paper provides a detailed look at the COMe-mRP10 (E2) module, engineered for applications where space is at a premium, yet high computational power is essential. Ideal for sectors such as industrial automation, medical engineering, and transportation, this technology supports complex applications demanding robust performance in tight spaces. Download White Paper.
Fibocom Leverages Qualcomm to Support 13 TOPS
During COMPUTEX TAIPEI , Fibocom launched a series of on-device AI solutions leveraging the Qualcomm QCS8550 and QCM6490 processors. The platform was developed to support compute-intensive application developments such as robotics, automated vehicles, video collaborations, and smart retailing to promote the enhancement of industrial digitalization and intelligent transformation. Read more.
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