Comprehensive Guide to Communication Chip Selection and Design: From 5G to IoT Applications

Communication Scenario Requirements Classification

1. Cellular Communication?(4G/5G base stations, CPE terminals, Industrial IoT)
2. Wireless LAN?(Wi-Fi 6/6E routers, Mesh networking)
3. Narrowband IoT?(NB-IoT, Cat-M1)
4. Edge Computing?(AIoT, smart gateways)

Recommended Chip Models and Comparisons

1.?HiSilicon Balong 5000 Series (5G Multi-Mode Chip)

Model: Balong 5000 (5G baseband chip) Advantages:

• Supports NSA/SA dual-mode 5G networks; backward-compatible with 2G/3G/4G.
• Theoretical peak rates: 4.6 Gbps downlink, 2.5 Gbps uplink.
• Low-power design for mobile terminals and CPE devices. Disadvantages:
• Requires external AP (e.g., Kirin series) for full functionality.
• High cost; suitable for mid-to-high-end devices. Applications: 5G CPE terminals, industrial routers, vehicular modules.

2.?HiSilicon Hi5662 (5G Base Station Chip)

Model: Hi5662 (Base station SoC) Advantages:

• Supports Massive MIMO and mmWave frequencies.
• High integration: Built-in baseband processing and RF frontend interfaces.
• Low latency for 5G macro/small cells. Disadvantages:
• Requires FPGA/DSP for flexible algorithms.
• High development complexity; Huawei authorization needed. Applications: 5G macro base stations, enterprise small cells, OpenRAN.

3.?HiSilicon Hi5651 (4G Cat.12 Baseband Chip)

Model: Hi5651 (LTE baseband) Advantages:

• 4G Cat.12 support: 600 Mbps downlink, 150 Mbps uplink.
• Low cost; ideal for mid/low-speed IoT and CPE devices.
• Mature ecosystem with extensive documentation. Disadvantages:
• No 5G support; limited future scalability.
• Higher power consumption vs. newer chips. Applications: 4G CPE, automotive modules, smart meters.

4.?HiSilicon Hi3861 (IoT Wi-Fi Chip)

Model: Hi3861 (Wi-Fi + MCU combo) Advantages:

• Wi-Fi 4 (802.11n) + LiteOS support.
• Ultra-low power: <1 mA standby current (battery-friendly).
• Integrated 32-bit MCU for edge computing tasks. Disadvantages:
• Low Wi-Fi speed (72 Mbps max); no Wi-Fi 6 support.
• Limited processing power for complex AI models. Applications: Smart home devices, low-power sensors.

5.?HiSilicon Hi1822 (Wi-Fi 6/6E Router Chip)

Model: Hi1822 (Wi-Fi 6 SoC) Advantages:

• Wi-Fi 6 (802.11ax) + 160 MHz bandwidth; 3 Gbps peak rate.
• Built-in NPU for AI-driven QoS optimization.
• Quad-core A53 architecture for high-concurrency scenarios. Disadvantages:
• High cost; requires external RF frontend.
• Thermal challenges; requires optimized cooling. Applications: Enterprise routers, Mesh networks, smart factories.