classification of PCB sectioning

Sectioning on the circuit board is like a X-ray for doctor, can find out the truth of the problem, find the production line of distress, and find a solution. Good slices, often unexpected benefits, so that people do have a great sense of accomplishment, so it is the industry's pursuit and the researchers also.

The dissecting section of the circuit board can be divided into three categories:

(1) general slice (official name for micro-slice)

It is possible to make vertical sections on the through-hole area and other areas of the board, and the Horizontal Section is also common practice. (See magazine NO 4 P37, see figure below)

The following are the same as the "

(2) cut holes

Be careful to use a diamond saw blade to cut a row of through holes from the center of the center, or half of the rows of holes through sandpaper, and place the semi-sealant through holes in a 20x-40x stereomicroscope Microscope) under the observation of half of the hole wall of the whole situation. At this time if the back of the hole and then the grinding is very thin, then the substrate will be transparent, can be backlit light method (Back light) check hole copper layer cover situation.

The following are the same as the "

(3) oblique slices (45 ° or 30 °)

Can be multi-layer plate area or through-hole area to do between the 45 degree oblique cut, and then observe the solid microscope microscope 45 degree section between the conductor.

from AKEN ZHANG.akenzhang@126.com