Is chemical opening worth it! You'll know the moment you break the seal

Manufacturers tend to be less wary of "fake chips" for components with long inspection times and high costs.

The detection method of chemical decapping and dissection (detection IC Decap) can better detect the inside of the wafer, identify the authenticity and identify whether the components are genuine.

Because the unsealing test can be done:

1. Indicator compliance test

The decapsulation process is a customer-approved destructive test that decapsulates a sample to check that the components meet the manufacturer's specifications. Once unpacked, we can verify that the mold size and manufacturer identification are correct.

2. Structural inspection

Unpack inspection confirms conformance to the manufacturer's construction by examining the mold construction below the surface of the component.

3. Confirm the part number

Through the unpacking inspection, we can more clearly see that the component number is correct and consistent, and avoid misjudging it as a counterfeit component.

4. Strictly check to ensure that the components are genuine

During the unpacking inspection, the quality inspector inspects the internal structure and outer layer of the component in depth to ensure that each part meets the manufacturer's specifications.

Previously, samples were sent to the laboratory for testing. Appearance testing and unpacking testing were performed. It was found that the sample that was opened had no wafers inside, but was actually an empty package!

Counterfeit products are hard to prevent, and only by identifying the authenticity of components can we better ensure quality. The unpacking test is an important means to ensure the authenticity and the best quality of the components.