Internal die probe SONET OC192
Laird Snowden
HELIOS, AHEL, IFPIC AT&T Bell Labs SONET CHIP SET. VFMA Wafer scale test , High Energy Laser Weapons, Millimeter Wave, Senior Electro-Optical Manager, Process & Electrical Engineer High Energy Projected Beam Weapons
This my Lab i built at Bell Labs for NPI RF device bring up.
I built this for internal RF Die probe debugging of a 10 G/b distributed logic CDR new design and process, using RF microwave fine tip probes from GGB (Doctor Greg Bolles)
It includes BERT, RF sampling scopes, wafer probe, internal die probe, confocal microscope, etc.
The laser internal die probe incorporates a three color laser to open the SiN cap dielectric layers to allow small RF probes to contact die metallization to inject and read RF signals throughout the die.
The power supplies connect to the die through its socketed package, the top of the package has been removed for probe.
You see the usual instruments, BERT set, sampling scope freq synth, freq counter. These also can connect to the RF ports on the package with bias tees.
CML logic on some ports of this device required a DC termination to a voltage at the end of the RF line.
This is my FA lab at Bell Labs, there is another die probe station in the back i used for distributed logic OC 768 die.
I also performed package test in this lab as well as in other labs at AT&T. Looks like i lent my SA to someone when this picture was taken.